Wen-Hua Chang
Inventor
Stats
- 14 US patents issued
- 23 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 14 US Patents Issued
- 23 US Applications Filed
- 144 Total Citation Count
- Jan 11, 2023 Most Recent Filing
- Sep 24, 2004 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| CHANG, WEN-HUA | 2
| 2004
|
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 2
| 2015
|
| MEDIATEK INC. | 2
2 5 4 3 3 | 2009
2010 2013 2014 2015 2016 |
| MITAC TECHNOLOGY CORP. | 1
| 2005
|
| WISTRON CORPORATION | 2
2 1 | 2014
2015 2016 |
| CHI, YUEH | 2
| 2004
|
Inventor Addresses
| Address | Duration |
|---|---|
| HSINCHU COUNTY, TW | Nov 23, 23 - Nov 23, 23 |
| Hsin-Chu, TW | Sep 17, 15 - Jun 07, 16 |
| Hsinchu County, TW | Sep 16, 14 - Dec 24, 24 |
| New Taipei City, TW | Jul 09, 15 - Nov 03, 16 |
| New Taipei, TW | Aug 16, 16 - Feb 18, 20 |
| Sinjhuang, TW | Dec 09, 08 - Dec 09, 08 |
| Tainan City, TW | Dec 11, 14 - Aug 10, 17 |
| Tainan County, TW | May 26, 11 - Oct 09, 12 |
| Tainan, TW | Dec 01, 15 - Dec 19, 17 |
| Taipei City, TW | Mar 30, 06 - Mar 30, 06 |
| Taoyuan City, TW | Jan 24, 19 - Jan 24, 19 |
| Taoyuan, TW | Dec 31, 19 - Dec 31, 19 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A47B: | TABLES; DESKS; OFFICE FURNITURE; CABINETS; DRAWERS; GENERAL DETAILS OF FURNITURE | 2 |
| A47F: | SPECIAL FURNITURE, FITTINGS, OR ACCESSORIES FOR SHOPS, STOREHOUSES, BARS, RESTAURANTS, OR THE LIKE; PAYING COUNTERS | 2 |
| B06B: | GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12175040 | 2024 | Ultrasonic sensing devices | 0 |
| 2023/0376,146 | 2023 | ULTRASONIC SENSING DEVICES | 0 |
| 10564760 | 2020 | Touch system, touch apparatus and control method thereof | 0 |
| 10518387 | 2019 | Grinding element, grinding wheel and manufacturing method of semiconductor package using the same | 3 |
| 2019/0022,827 | 2019 | GRINDING ELEMENT, GRINDING WHEEL AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING THE SAME | 1 |
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