Hoon Chang
Inventor
Stats
- 38 US patents issued
- 59 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 38 US Patents Issued
- 59 US Applications Filed
- 1418 Total Citation Count
- Dec 11, 2023 Most Recent Filing
- Jun 14, 1999 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| MAGNACHIP SEMICONDUCTOR, LTD. | 1
| 2002
|
| HYUNDAI MOTOR COMPANY | 2
2 2 3 | 2006
2013 2014 2016 |
| SAMSUNG ELECTRONICS CO., LTD. | 5
10 6 2 3 2 2 2 4 1 3 2 6 3 2 1 | 1999
2000 2001 2002 2003 2004 2005 2007 2008 2009 2010 2011 2012 2013 2014 2015 |
| SEROME TECHNOLOGY, INC. | 1
| 2001
|
| MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. | 1
| 2000
|
| LG ELECTRONICS INC. | 1
| 2016
|
Inventor Addresses
| Address | Duration |
|---|---|
| Cheonan, KR | Dec 06, 05 - Dec 06, 05 |
| Cheonan-City, KR | Dec 04, 03 - Dec 04, 03 |
| Cheongju-shi, KR | Nov 07, 02 - Nov 07, 02 |
| Hwaseong, KR | Oct 21, 08 - Oct 21, 08 |
| Hwaseong-city, KR | Jan 17, 08 - Jan 17, 08 |
| Hwaseong-si, KR | Jun 04, 09 - Mar 10, 15 |
| Seoul, KR | Sep 13, 01 - Mar 27, 25 |
| Suwon-si, KR | Jan 03, 08 - Jan 11, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 3 |
| B29K: | INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS | 1 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0102,617 | 2025 | FENDER COVER FOR MOUNTING OF AUTONOMOUS DRIVING SENSOR | 0 |
| 12231878 | 2025 | Method and apparatus for performing handover in wireless communication system | 0 |
| 2024/0352,656 | 2024 | CLOTHING TREATMENT APPARATUS | 0 |
| 2024/0107,298 | 2024 | METHOD AND APPARATUS FOR PERFORMING HANDOVER IN WIRELESS COMMUNICATION SYSTEM | 0 |
| 2024/0014,210 | 2024 | POWER MANAGEMENT INTEGRATED CIRCUIT AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | 0 |
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