Chia-Lun Chang
Inventor
Stats
- 4 US patents issued
- 39 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 4 US Patents Issued
- 39 US Applications Filed
- 169 Total Citation Count
- Apr 22, 2024 Most Recent Filing
- Jun 6, 2007 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 2
2 | 2014
2015 |
| NATIONAL CENTRAL UNIVERSITY | 1
1 | 2007
2008 |
| OMNIVISION TECHNOLOGIES, INC. | 1
| 2007
|
| WINTEK CORPORATION | 1
| 2014
|
Inventor Addresses
| Address | Duration |
|---|---|
| Changhua City, TW | Jul 16, 15 - Jul 16, 15 |
| Changhua, TW | Oct 10, 17 - Oct 10, 17 |
| Hsinchu City, TW | Jan 13, 22 - Jan 13, 22 |
| Hsinchu, TW | Mar 29, 22 - Mar 29, 22 |
| Jhongli City, TW | Jun 11, 09 - Jun 11, 09 |
| Kaohsiung City, TW | - |
| New Taipei City, TW | Jul 19, 18 - Jun 25, 20 |
| New Taipei, TW | Oct 23, 18 - Oct 20, 20 |
| Sunnyvale, CA, US | Aug 16, 11 - Aug 16, 11 |
| Tainan City, TW | Feb 02, 17 - Aug 15, 24 |
| Tainan, TW | Feb 14, 17 - Apr 01, 25 |
| Taoyuan County, TW | Mar 19, 15 - Mar 19, 15 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 3 |
| F21V: | FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR | 1 |
| G01C: | MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12266673 | 2025 | Semiconductor package and method of forming the same | 0 |
| 2024/0274,589 | 2024 | MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE | 0 |
| 11996400 | 2024 | Manufacturing method of package on package structure | 0 |
| 2024/0153,842 | 2024 | Integrated Fan-Out Packages with Embedded Heat Dissipation Structure | 0 |
| 11901258 | 2024 | Iintegrated fan-out packages with embedded heat dissipation structure | 0 |
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