Rogelio Cicili
Inventor
Stats
- 0 US patents issued
- 25 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 25 US Applications Filed
- 5 Total Citation Count
- Jan 27, 2023 Most Recent Filing
- Oct 5, 2016 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| Corvallis, CA, US | Aug 29, 24 - Aug 29, 24 |
| Corvallis, OR, US | Jul 18, 19 - Nov 30, 21 |
| San Diego, CA, US | Oct 01, 20 - Feb 25, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B05B: | SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES | 1 |
| B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 1 |
| B33Y: | Description for this Non-US Classification is not available. | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12233645 | 2025 | Fluidic die having trickle-warming and pulse-warming circuits | 0 |
| 2024/0286,402 | 2024 | INTEGRATED CIRCUITS INCLUDING HIGH-VOLTAGE HIGH-POWER AND HIGH-VOLTAGE LOW-POWER SUPPLY NODES | 0 |
| 2024/0258,979 | 2024 | INTRINSIC MOS CASCODE DIFFERENTIAL INPUT PAIR | 0 |
| 11966247 | 2024 | Wide-swing intrinsic MOSFET cascode current mirror | 1 |
| 11951739 | 2024 | Fluidic die with high aspect ratio power bond pads | 0 |
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