Ming-Da Cheng
Inventor
Stats
- 172 US patents issued
- 447 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 172 US Patents Issued
- 447 US Applications Filed
- 3094 Total Citation Count
- Jul 31, 2024 Most Recent Filing
- Dec 24, 2008 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 19
47 56 53 78 29 30 7 | 2010
2011 2012 2013 2014 2015 2016 2017 |
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LLC | 1
| 2011
|
| MACRONIX INTERNATIONAL CO., LTD. | 2
2 | 2008
2011 |
Inventor Addresses
| Address | Duration |
|---|---|
| HSINCHU COUNTRY, TW | Dec 18, 14 - Sep 24, 20 |
| HSINCHU COUNTY, TW | Aug 20, 15 - Nov 07, 24 |
| Hsin-Chu, TW | Feb 25, 16 - Feb 13, 18 |
| Hsinchu Country, TW | Sep 18, 14 - May 03, 22 |
| Hsinchu County, TW | May 28, 15 - Oct 15, 24 |
| Hsinchu, TW | Mar 24, 15 - Apr 10, 25 |
| Jhubei City, Hsinchu County, TW | Nov 01, 18 - Nov 01, 18 |
| Jhubei City, TW | May 05, 11 - Nov 28, 24 |
| Jhubei, JP | Dec 03, 13 - Dec 03, 13 |
| Jhubei, TW | Jul 24, 12 - Nov 12, 24 |
| MiaoLi, TW | Nov 29, 11 - Nov 29, 11 |
| Miaoli, TW | Jul 23, 09 - Jul 23, 09 |
| TAOYUAN CITY, TW | Nov 28, 19 - Jan 14, 21 |
| Taoyuan City, TW | Apr 25, 19 - Nov 21, 24 |
| Taoyuan, TW | Dec 17, 19 - Mar 27, 25 |
| Tonfene City, TW | Mar 01, 12 - Mar 01, 12 |
| Tonfene, TW | Feb 18, 14 - Feb 18, 14 |
| Zhubei City, TW | Nov 02, 17 - Oct 25, 18 |
| Zhubei, TW | Jan 02, 18 - Nov 17, 20 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A21B: | BAKERS' OVENS; MACHINES OR EQUIPMENT FOR BAKING | 1 |
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 19 |
| B23Q: | DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0118,615 | 2025 | PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHODS OF FORMING THE SAME | 0 |
| 2025/0118,697 | 2025 | PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME | 0 |
| 2025/0105,142 | 2025 | RADIO FREQUENCY INDUCTOR | 0 |
| 12255131 | 2025 | Capacitor between two passivation layers with different etching rates | 0 |
| 12255166 | 2025 | Semiconductor package structure comprising via structure and redistribution layer structure | 0 |
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