Hsien-Wei Chen
Inventor
Stats
- 343 US patents issued
- 976 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 343 US Patents Issued
- 976 US Applications Filed
- 6260 Total Citation Count
- Dec 17, 2024 Most Recent Filing
- May 29, 2003 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., ("TSMC") | 2
| 2017
|
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 5
12 21 26 18 16 44 53 54 82 97 107 58 14 | 2004
2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 |
ACER INCORPORATED | 2
9 4 8 | 2012
2013 2014 2015 |
UNITED MICROELECTRONICS CORP. | 1
| 2003
|
Inventor Addresses
Address | Duration |
---|---|
HSINCHU CITY, TW | Apr 23, 15 - Nov 14, 24 |
Hsin-Chu City, TW | May 23, 13 - Mar 31, 16 |
Hsin-Chu, TW | Jul 18, 13 - May 25, 21 |
Hsin-chu, TW | May 29, 14 - May 31, 16 |
Hsinchu City, TW | Oct 25, 12 - Apr 10, 25 |
Hsinchu, TW | Dec 31, 13 - Apr 10, 25 |
New Taipei City, TW | Jul 03, 14 - Jun 04, 20 |
New Taipei, TW | Jul 16, 13 - Aug 04, 20 |
Shinying City, TW | Oct 27, 05 - Jun 15, 06 |
Singing, TW | Apr 22, 08 - Apr 22, 08 |
Sinying City, TW | Jun 15, 06 - Nov 05, 15 |
Sinying, TW | Mar 27, 07 - Mar 06, 18 |
Tainan County, TW | Mar 27, 08 - Jan 14, 14 |
Tainan, TW | Dec 02, 04 - Dec 06, 11 |
Taipei, TW | Jun 26, 18 - Jun 26, 18 |
Xinying, TW | Sep 02, 08 - Sep 02, 08 |
Technology Profile
Technology | Matters | |
---|---|---|
B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 6 |
B81C: | PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS | 1 |
C23C: | COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2025/0118,711 | 2025 | SEMICONDUCTOR PACKAGE WITH SHARED BARRIER LAYER IN REDISTRIBUTION AND VIA | 0 |
2025/0118,575 | 2025 | INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF | 0 |
12266637 | 2025 | Die stack structure and manufacturing method thereof | 0 |
12266584 | 2025 | Integrated circuit package and method | 0 |
12261163 | 2025 | Molded dies in semiconductor packages and methods of forming same | 0 |
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