Hsien-Wei Chen

Inventor

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Work History

Patent OwnerApplications FiledYear
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., ("TSMC")
2
2017
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
5
12
21
26
18
16
44
53
54
82
97
107
58
14
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
ACER INCORPORATED
2
9
4
8
2012
2013
2014
2015
UNITED MICROELECTRONICS CORP.
1
2003

Inventor Addresses

AddressDuration
HSINCHU CITY, TWApr 23, 15 - Nov 14, 24
Hsin-Chu City, TWMay 23, 13 - Mar 31, 16
Hsin-Chu, TWJul 18, 13 - May 25, 21
Hsin-chu, TWMay 29, 14 - May 31, 16
Hsinchu City, TWOct 25, 12 - Apr 10, 25
Hsinchu, TWDec 31, 13 - Apr 10, 25
New Taipei City, TWJul 03, 14 - Jun 04, 20
New Taipei, TWJul 16, 13 - Aug 04, 20
Shinying City, TWOct 27, 05 - Jun 15, 06
Singing, TWApr 22, 08 - Apr 22, 08
Sinying City, TWJun 15, 06 - Nov 05, 15
Sinying, TWMar 27, 07 - Mar 06, 18
Tainan County, TWMar 27, 08 - Jan 14, 14
Tainan, TWDec 02, 04 - Dec 06, 11
Taipei, TWJun 26, 18 - Jun 26, 18
Xinying, TWSep 02, 08 - Sep 02, 08

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 6
B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS 1
C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2025/0118,7112025SEMICONDUCTOR PACKAGE WITH SHARED BARRIER LAYER IN REDISTRIBUTION AND VIA0
2025/0118,5752025INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF0
122666372025Die stack structure and manufacturing method thereof0
122665842025Integrated circuit package and method0
122611632025Molded dies in semiconductor packages and methods of forming same0

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