HENG-CHANG CHEN
Inventor
Stats
- 0 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 2 US Applications Filed
- 0 Total Citation Count
- Sep 30, 2024 Most Recent Filing
- Sep 27, 2023 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| New Taipei City, TW | Mar 28, 24 - Apr 03, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B81B: | MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES | 1 |
| G01D: | MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED BY A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR | 1 |
| G01J: | MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0109,972 | 2025 | SENSOR PACKAGE AND SENSING MODULE THEREOF | 0 |
| 2024/0102,854 | 2024 | SENSOR PACKAGE AND ELECTRONIC DEVICE | 0 |
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