Heinz-Joachim Butz
Inventor
Stats
- 1 US patents issued
- 1 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 1 US Applications Filed
- 7 Total Citation Count
- Aug 4, 2006 Most Recent Filing
- Aug 4, 2006 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SGL CARBON AG | 1
| 2006
|
| SGL CARBON SE | 2
| 2006
|
| SAINT-GOBAIN RIGIPS GMBH | 2
| 2006
|
Inventor Addresses
| Address | Duration |
|---|---|
| Bodenwerder, DE | Feb 08, 07 - Jul 03, 12 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B28B: | SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER | 1 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 8211556 | 2012 | Gypsum-based building material having increased thermal conductivity and shielding attenuation, method for producing the building material, molding containing the building material and method for producing the molding | 1 |
| 2007/0031,704 | 2007 | Gypsum-based building material having increased thermal conductivity and shielding attenuation, method for producing the building material, molding containing the building material and method for producing the molding | 4 |
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