Trevor Burward-Hoy
Inventor
Stats
- 10 US patents issued
- 10 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 10 US Patents Issued
- 10 US Applications Filed
- 547 Total Citation Count
- Jun 3, 1997 Most Recent Filing
- Jan 26, 1994 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| ADVANTEST CORPORATION | 1
| 1996
|
| SUN MICROSYSTEMS, INC. | 4
2 2 | 1994
1995 1997 |
| ORACLE AMERICA, INC. | 1
| 1995
|
Inventor Addresses
| Address | Duration |
|---|---|
| 10384 Dempster Ave., Cupertino, CA 95014 | Nov 02, 99 - Nov 02, 99 |
| Cupertino, CA | Aug 15, 95 - Feb 29, 00 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23P: | OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS | 2 |
| F25B: | REFRIGERATION MACHINES, PLANTS, OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS | 1 |
| F28D: | HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 6029742 | 2000 | Heat exchanger for electronic equipment | 48 |
| 5977785 | 1999 | Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment | 99 |
| 5815921 | 1998 | Electronic package cooling system and heat sink with heat transfer assembly | 21 |
| 5697434 | 1997 | Device having a reduced parasitic thermal load for terminating thermal conduit | 3 |
| 5637921 | 1997 | Sub-ambient temperature electronic package | 70 |
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