Daniel Burgstaller
Inventor
Stats
- 5 US patents issued
- 6 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 5 US Patents Issued
- 6 US Applications Filed
- 42 Total Citation Count
- Sep 30, 2015 Most Recent Filing
- Mar 31, 2010 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
EV Group W. Thallner GmbH | 1
| 2011
|
EV GROUP GMBH | 4
2 | 2010
2014 |
EV GROUP E. THALLNER GMBH | 4
1 | 2011
2015 |
Inventor Addresses
Address | Duration |
---|---|
Neuhofen im Innkreis, AT | Jan 23, 14 - Apr 30, 19 |
Neuhofen/Innkreis, AT | May 10, 12 - Sep 20, 16 |
Technology Profile
Technology | Matters | |
---|---|---|
B23P: | OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS | 1 |
B25B: | TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING, OR HOLDING | 2 |
B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 2 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
10272660 | 2019 | Bendable carrier mount, device and method for releasing a carrier substrate | 0 |
9449863 | 2016 | Device for aligning and pre-fixing a wafer | 0 |
9378996 | 2016 | Holding device for holding a patterned wafer | 0 |
9296193 | 2016 | Bendable carrier mount, device and method for releasing a carrier substrate | 17 |
9278433 | 2016 | Receiving device for receiving semiconductor substrates | 1 |
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