Mai-Anh T Bui
Inventor
Stats
- 0 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 2 US Applications Filed
- 64 Total Citation Count
- Sep 5, 2018 Most Recent Filing
- Mar 10, 2015 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SIEMENS PRODUCT LIFECYCLE MANAGEMENT SOFTWARE INC. | 1
| 2015
|
Inventor Addresses
| Address | Duration |
|---|---|
| Huntington Beach, CA, US | Sep 15, 16 - Apr 05, 22 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 2 |
| B33Y: | Description for this Non-US Classification is not available. | 1 |
| G06F: | ELECTRIC DIGITAL DATA PROCESSING | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11292201 | 2022 | Additive swept wedge buildup toolpath | 0 |
| 2020/0004,907 | 2020 | ADDITIVE SWEPT WEDGE BUILDUP TOOLPATH | 0 |
| 2016/0263,832 | 2016 | APPARATUS AND METHOD FOR ADDITIVE MANUFACTURING | 61 |
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