Kevin Buermann
Inventor
Stats
- 2 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 2 US Applications Filed
- 10 Total Citation Count
- May 11, 2016 Most Recent Filing
- Feb 8, 2013 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| FLEX LTD | 1
| 2013
|
| FLEXTRONICS AUTOMOTIVE GMBH & CO. KG | 2
| 2016
|
Inventor Addresses
| Address | Duration |
|---|---|
| Lakeville, MN, US | Aug 25, 15 - Dec 12, 17 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 1 |
| H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 9844146 | 2017 | Electrical circuitry assembly and method for manufacturing the same | 0 |
| 2017/0332,492 | 2017 | ELECTRICAL CIRCUITRY ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME | 0 |
| 9117991 | 2015 | Use of flexible circuits incorporating a heat spreading layer and the rigidizing specific areas within such a construction by creating stiffening structures within said circuits by either folding, bending, forming or combinations thereof | 10 |
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