Audrey Berthelot

Inventor

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Work History

Patent OwnerApplications FiledYear
KONINKLIJKE PHILIPS ELECTRONICS N.V.
1
2006
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
2
5
2
2
2010
2012
2013
2015
NXP USA, INC.
2
2012
NXP B.V.
1
2006

Inventor Addresses

AddressDuration
Grenoble Cedex 9, FRNov 02, 23 - Nov 02, 23
Les Ulis, FRJul 11, 13 - Jul 11, 13
Saint Ismier, FRMay 07, 09 - Oct 04, 22
Saint-Ismier, FRSep 20, 18 - Dec 27, 22
St Ismier, FRJan 12, 12 - Apr 07, 15
St. Ismier, FRJun 26, 14 - Jun 26, 14

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1
B81B: MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES 5
B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS 6

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2023/0348,2622023MEMS DEVICE MANUFACTURING METHOD0
115387182022Method of producing semiconductor devices in a substrate including etching of the pattern of an etch mask and/or a reticle to create the first dicing lanes encircling the devices and second dicing lanes defined by fracture lines of the edges of the substrate1
114592272022Hinged microelectromechanical and/or nanoelectromechanical device with out-of-plane movement0
113126182022Microdevice comprising at least two movable elements0
2021/0130,1582021MICRODEVICE COMPRISING AT LEAST TWO MOVABLE ELEMENTS0

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