Daizou Baba
Inventor
Stats
- 1 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 2 US Applications Filed
- 53 Total Citation Count
- Mar 18, 2019 Most Recent Filing
- Oct 28, 2002 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| PANASONIC ELECTRIC WORKS CO., LTD. | 2
| 2002
|
Inventor Addresses
| Address | Duration |
|---|---|
| Hyogo, JP | Jan 07, 21 - Jan 07, 21 |
| Osaka, JP | Jun 02, 05 - Jul 25, 06 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C08J: | WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER- TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C C08F, C08G or C08H | 1 |
| C08L: | COMPOSITIONS OF MACROMOLECULAR COMPOUNDS | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2021/0002,434 | 2021 | RESIN POWDER, SEALING MATERIAL, ELECTRONIC COMPONENT, AND RESIN POWDER MANUFACTURING METHOD | 0 |
| 7080446 | 2006 | Wiring board sheet and its manufacturing method, multilayer board and its manufacturing method | 19 |
| 2005/0118,750 | 2005 | Wiring board sheet and its manufacturing method,multilayer board and its manufacturing method | 7 |
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