Akio Ashida
Inventor
Stats
- 4 US patents issued
- 4 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 4 US Patents Issued
- 4 US Applications Filed
- 93 Total Citation Count
- Aug 11, 2000 Most Recent Filing
- Oct 23, 1995 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| Hitachi Zosen Metal Works Co., Ltd. | 1
| 1997
|
| Super Silicon Crystal Research Institute Corp. | 1
| 2000
|
| SHIN-ETSU HANDOTAI CO., LTD. | 1
1 1 | 1995
1997 1999 |
| Mimasu Semiconductor Industry Co., Ltd. | 1
1 | 1995
1997 |
| OHTOMO CHEMICAL IND., CORP. | 1
1 1 1 | 1995
1997 1999 2000 |
Inventor Addresses
| Address | Duration |
|---|---|
| Tokyo, JP | Dec 02, 97 - Jul 23, 02 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B01D: | SEPARATION | 1 |
| B23D: | PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR | 1 |
| C10M: | LUBRICATING COMPOSITIONS | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 6422067 | 2002 | Slurry useful for wire-saw slicing and evaluation of slurry | 5 |
| 6221814 | 2001 | Aqueous compositions, aqueous cutting fluid using the same, method for preparation thereof, and cutting method using the cutting fluid | 17 |
| 6001265 | 1999 | Recovery of coolant and abrasive grains used in slicing semiconductor wafers | 25 |
| 5693596 | 1997 | Cutting fluid, method for production thereof, and method for cutting ingot | 7 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.