ISAO ARITOME
Inventor
Stats
- 1 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 2 US Applications Filed
- 21 Total Citation Count
- Aug 26, 2015 Most Recent Filing
- Aug 19, 2014 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| JSR CORPORATION | 1
2 | 2014
2015 |
Inventor Addresses
| Address | Duration |
|---|---|
| Minato-ku, JP | Feb 25, 16 - Feb 25, 16 |
| Tokyo, JP | Mar 03, 16 - Jan 10, 17 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C08K: | USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS | 1 |
| C09D: | COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR | 1 |
| H01B: | CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 9543201 | 2017 | Method for forming three-dimensional interconnection, circuit arrangement comprising three-dimensional interconnection, and metal film-forming composition for three-dimensional interconnection | 0 |
| 2016/0064,280 | 2016 | METHOD FOR FORMING THREE-DIMENSIONAL INTERCONNECTION, CIRCUIT ARRANGEMENT COMPRISING THREE-DIMENSIONAL INTERCONNECTION, AND METAL FILM-FORMING COMPOSITION FOR THREE-DIMENSIONAL INTERCONNECTION | 12 |
| 2016/0057,866 | 2016 | METAL FILM FORMING METHOD AND CONDUCTIVE INK USED IN SAID METHOD | 7 |
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