Natsuki Amanokura
Inventor
Stats
- 6 US patents issued
- 8 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 6 US Patents Issued
- 8 US Applications Filed
- 33 Total Citation Count
- Sep 11, 2013 Most Recent Filing
- Jul 12, 2005 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| NISSO CHEMICAL ANALYSIS SERVICE CO., LTD. | 2
| 2010
|
| NIPPON SODA CO., LTD. | 2
1 2 6 2 1 | 2005
2006 2008 2010 2011 2013 |
Inventor Addresses
| Address | Duration |
|---|---|
| Chiba, JP | Jan 05, 12 - Jan 05, 12 |
| Ichihara, JP | Jan 28, 10 - Jun 30, 15 |
| Ichihara-shi, JP | Dec 06, 07 - Aug 02, 12 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A01N: | PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF | 1 |
| A01P: | BIOCIDAL, PEST REPELLANT, PEST ATTRACTANT OR PLANT GROWTH REGULATORY ACTIVITY OF CHEMICAL COMPOUNDS OR PREPARATIONS | 1 |
| C07C: | ACYCLIC OR CARBOCYCLIC COMPOUNDS | 4 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 9068074 | 2015 | Composition for formation of cured epoxy resin, and cured products thereof | 0 |
| 8735529 | 2014 | Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin | 0 |
| 8653160 | 2014 | Inclusion complex containing epoxy resin composition for semiconductor encapsulation | 0 |
| 2014/0011,326 | 2014 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | 0 |
| 8623942 | 2014 | Epoxy resin composition, curing agent, and curing accelerator | 1 |
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