Masazumi Amagai

Inventor

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Work History

Patent OwnerApplications FiledYear
SENJU METAL INDUSTRY CO., LTD.
2
3
2003
2004
LINTEC CORPORATION
1
1
1
2
1994
1997
1998
2007
SAMSUNG ELECTRO-MECHANICS CO., LTD.
1
2017
TEXAS INSTRUMENTS JAPAN, LTD.
1
1
1997
1998
TEXAS INSTRUMENTS INCORPORATED
2
1
1
2
1
4
2
1
4
2
8
7
4
2
2
1994
1995
1996
1997
1998
1999
2001
2002
2003
2005
2006
2009
2010
2011
2012
RENESAS ELECTRONICS CORPORATION
1
1
1994
1995

Inventor Addresses

AddressDuration
Beppu, JPSep 28, 99 - Nov 07, 00
HIJI OITA, JPSep 19, 02 - Sep 19, 02
Hayami-gun, JPMar 16, 99 - Dec 28, 99
Ibaraki, JPJul 26, 07 - Apr 15, 10
Ibaraki-ken, JPJun 10, 10 - Aug 30, 12
Oita, JPMay 15, 01 - May 09, 06
Oita-shi, JPMay 15, 03 - Jun 16, 05
Olta, JPJul 13, 04 - Jul 13, 04
Suwon-si, KRDec 28, 17 - Jan 11, 24
Tsujyba-shi, JPJul 09, 09 - Jul 09, 09
Tsukuba, JPApr 18, 06 - Dec 03, 13
Tsukuba-city, JPFeb 03, 11 - Feb 03, 11
Tsukuba-shi, JPDec 30, 04 - Oct 20, 11
Ushiku, JPApr 11, 95 - Oct 02, 01

Technology Profile

Technology Matters
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 1
C22C: ALLOYS 3
H01L: SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 38

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2024/0014,1192024FAN-OUT SEMICONDUCTOR PACKAGE0
118108482023Fan-out semiconductor package0
2021/0375,7392021FAN-OUT SEMICONDUCTOR PACKAGE0
110946232021Fan-out semiconductor package0
2020/0176,3702020FAN-OUT SEMICONDUCTOR PACKAGE0

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