Joseph A Abys
Inventor
Stats
- 40 US patents issued
- 55 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 40 US Patents Issued
- 55 US Applications Filed
- 717 Total Citation Count
- May 6, 2016 Most Recent Filing
- Nov 16, 1981 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| AT&T Bell Laboratories | 1
3 1 1 1 2 3 1 1 | 1982
1983 1984 1988 1989 1990 1991 1992 1993 |
| ENTHONE INC. | 5
2 2 8 12 3 3 6 2 1 | 2004
2005 2006 2007 2008 2009 2011 2012 2013 2014 |
| BELL TELEPHONE LABORATORIES, INCORPORATED | 1
2 1 1 1 | 1981
1982 1983 1988 1989 |
| MACDERMID ENTHONE INC. | 2
| 2015
|
| AMERICAN TELEPHONE AND TELEGRAPH COMPANY | 1
1 1 3 1 2 | 1988
1989 1990 1991 1992 1993 |
| BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT | 1
| 2012
|
| A CORP OF JAPAN | 1
| 1982
|
| WSOU INVESTMENTS, LLC | 2
2 | 2001
2002 |
| PROVENANCE ASSET GROUP LLC | 1
1 | 1999
2001 |
| LUCENT TECHNOLOGIES INC. | 1
1 1 1 1 2 1 1 4 2 | 1982
1983 1988 1989 1990 1991 1993 1999 2001 2002 |
Inventor Addresses
| Address | Duration |
|---|---|
| 80 Mountainview Rd., Warren, NJ 07060 | May 09, 95 - May 09, 95 |
| Bridgewater, NJ | Jan 03, 84 - Apr 23, 85 |
| Guilford, CT, US | Nov 25, 10 - Jan 21, 20 |
| Howell, NJ | Apr 01, 03 - May 04, 04 |
| Howell, NJ, US | Dec 26, 02 - Aug 28, 03 |
| Warren, NJ | Mar 27, 90 - Dec 25, 08 |
| Warren, NJ, US | Feb 05, 09 - Jul 10, 18 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 11 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 8 |
| B44C: | PRODUCING DECORATIVE EFFECTS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 10541140 | 2020 | Process for filling vias in the microelectronics | 0 |
| 10221496 | 2019 | Copper filling of through silicon vias | 0 |
| 2019/0003,068 | 2019 | COPPER FILLING OF THROUGH SILICON VIAS | 0 |
| 10103029 | 2018 | Process for filling vias in the microelectronics | 1 |
| 10017863 | 2018 | Corrosion protection of bronzes | 0 |
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