Fumitaka Arai
Inventor
Stats
- 156 US patents issued
- 238 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 156 US Patents Issued
- 238 US Applications Filed
- 4681 Total Citation Count
- Sep 17, 2024 Most Recent Filing
- May 14, 1998 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| POLYMATECH CO., LTD. | 1
1 | 2008
2009 |
| HITACHI, LTD. | 2
| 2001
|
| POLYMATECH JAPAN CO., LTD. | 2
| 2008
|
| KABUSHIKI KAISHA TOSHIBA | 1
5 5 8 20 13 33 28 11 16 9 9 4 1 1 2 1 | 1999
2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 |
| TOSHIBA MEMORY CORPORATION | 1
2 5 5 12 3 12 10 14 14 11 10 16 10 3 5 11 6 | 1998
2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2014 2015 2016 2017 |
Inventor Addresses
| Address | Duration |
|---|---|
| Isogo-Ku, JP | Apr 24, 01 - Jul 02, 02 |
| Kanagawa, JP | Jan 06, 05 - Sep 17, 13 |
| Kanagawa-ken, JP | Dec 30, 04 - Nov 12, 13 |
| Kawagoe, JP | Oct 16, 12 - Oct 16, 12 |
| Kawagoe-shi, JP | - |
| Kawasaki, JP | Oct 17, 00 - Jul 17, 12 |
| Kawasaki-shi, JP | Feb 20, 03 - Nov 03, 11 |
| Mie, JP | May 24, 12 - Dec 19, 23 |
| Mie-ken, JP | Sep 26, 13 - Jun 16, 15 |
| Minato-ku, JP | Feb 16, 12 - Feb 16, 12 |
| Minato-ku, Tokyo, JP | Aug 16, 07 - Aug 16, 07 |
| Tokyo, JP | Jan 15, 09 - Feb 11, 10 |
| YOKKAICHI, JP | Aug 24, 17 - Aug 24, 17 |
| Yokkaichi Mie, JP | Aug 30, 16 - Jan 09, 25 |
| Yokkaichi, JP | Nov 27, 12 - May 14, 24 |
| Yokkaichi-Shi, JP | Jun 24, 10 - Jun 24, 10 |
| Yokkaichi-shi, JP | Aug 30, 12 - Sep 12, 13 |
| Yokohama Kanagawa, JP | Sep 12, 24 - Sep 12, 24 |
| Yokohama, JP | Nov 06, 01 - Mar 19, 24 |
| Yokohama-Shi, JP | Sep 12, 02 - Oct 13, 11 |
| Yokohama-shi, JP | Nov 08, 01 - Oct 17, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B21J: | FORGING; HAMMERING; PRESSING; RIVETING; FORGE FURNACES | 1 |
| B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 1 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0016,976 | 2025 | SEMICONDUCTOR MEMORY DEVICE | 0 |
| 12127391 | 2024 | Semiconductor memory device | 0 |
| 2024/0342,999 | 2024 | BONDING METHOD | 0 |
| 2024/0304,548 | 2024 | SEMICONDUCTOR MEMORY DEVICE | 0 |
| 2024/0188,307 | 2024 | SEMICONDUCTOR MEMORY AND METHOD OF MANUFACTURING THE SAME | 0 |
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