KEISUKE AKASHI
Inventor
Stats
- 0 US patents issued
- 3 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 3 US Applications Filed
- 4 Total Citation Count
- Mar 25, 2020 Most Recent Filing
- Jul 9, 2015 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| NIPPON MICROMETAL CORPORATION | 1
| 2015
|
| NIPPON STEEL & SUMIKIN MATERIALS CO., LTD. | 1
| 2015
|
Inventor Addresses
| Address | Duration |
|---|---|
| Saitama, JP | Jul 27, 17 - Dec 03, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 3 |
| C22C: | ALLOYS | 2 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12157189 | 2024 | Junction structure, method for manufacturing junction structure, and solder ball | 0 |
| 2022/0241,903 | 2022 | JUNCTION STRUCTURE, METHOD FOR MANUFACTURING JUNCTION STRUCTURE, AND SOLDER BALL | 0 |
| 2017/0259,366 | 2017 | LEAD-FREE SOLDER BUMP JOINING STRUCTURE | 4 |
| 2017/0209,964 | 2017 | SOLDER BALL AND ELECTRONIC MEMBER | 0 |
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