Walsin Advanced Electronics LTD

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 5357
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
6762118 Package having array of metal pegs linked by printed circuit linesFeb 25, 02Jul 13, 04[H01L]
6486564 Heat dissipation module for a BGA ICAug 15, 01Nov 26, 02[H01L]
6459148 QFN semiconductor packageNov 13, 00Oct 01, 02[H01L]
6385049 Multi-board BGA packageJul 05, 01May 07, 02[H05K]
6337510 Stackable QFN semiconductor packageNov 17, 00Jan 08, 02[H01L]
6204553 Lead frame structureAug 10, 99Mar 20, 01[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2003/0224,542 Method for making multi-chip packages and single chip packages simultaneously and structures from thereofAbandonedMay 29, 02Dec 04, 03[H01L]
6650005 Micro BGA packageExpiredMay 29, 02Nov 18, 03[H01L]
2003/0100,174 Process for making a ball grid array semiconductor packageAbandonedNov 28, 01May 29, 03[H01L]
2003/0038,347 Stackable-type semiconductor packageAbandonedAug 22, 01Feb 27, 03[H01L]
6521485 Method for manufacturing wafer level chip size packageExpiredJan 17, 01Feb 18, 03[H01L]
2003/0006,055 Semiconductor package for fixed surface mountingAbandonedJul 05, 01Jan 09, 03[H02G]
2003/0001,250 TCP optical deviceAbandonedJun 27, 01Jan 02, 03[H01L]
2002/0182,773 Method for bonding inner leads of leadframe to substrateAbandonedJun 04, 01Dec 05, 02[H01L]
2002/0173,074 Method for underfilling bonding gap between flip-chip and circuit substrateAbandonedMay 16, 01Nov 21, 02[H01L]
6459162 Encapsulated semiconductor die packageExpiredMar 27, 01Oct 01, 02[H01L]
2002/0127,976 Built-in micro-speaker for wireless communication deviceAbandonedMar 09, 01Sep 12, 02[H04R]
6437429 Semiconductor package with metal padsExpiredMay 11, 01Aug 20, 02[H01L]
2002/0094,683 Method for manufacturing chip size package and its structureAbandonedJan 17, 01Jul 18, 02[H01L]
6380062 Method of fabricating semiconductor package having metal peg leads and connected by trace linesExpiredMar 09, 01Apr 30, 02[H01L]
6380624 Stacked integrated circuit structureExpiredOct 10, 00Apr 30, 02[H01L]
6278182 Lead frame type semiconductor packageExpiredAug 12, 99Aug 21, 01[H01L]
6262475 Lead frame with heat slugExpiredFeb 16, 99Jul 17, 01[H01L]
6078099 Lead frame structure for preventing the warping of semiconductor package bodyExpiredFeb 16, 99Jun 20, 00[H01L]

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