WACHOVIA CAPITAL FINANCE CORPORATION ( NEW ENGLAND), AS AGENT

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 11145
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 4358
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 4129
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 3156
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 186
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 150
 
  
 
E04B GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS 146
 
  
 
G06Q DATA PROCESSING SYSTEMS OR METHODS, SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORY OR FORECASTING PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORY OR FORECASTING PURPOSES, NOT OTHERWISE PROVIDED FOR 1173
 
  
 
H01K ELECTRIC INCANDESCENT LAMPS 121

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7552091 Method and system for tracking goodsJun 04, 04Jun 23, 09[G06Q]
7294791 Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing sameSep 29, 04Nov 13, 07[H01R]
7270845 Dielectric composition for forming dielectric layer for use in circuitized substratesMar 31, 04Sep 18, 07[H01K]
7211289 Method of making multilayered printed circuit board with filled conductive holesDec 18, 03May 01, 07[B05D]
7209368 Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of makingMar 03, 04Apr 24, 07[H05K]
7176383 Printed circuit board with low cross-talk noiseDec 22, 03Feb 13, 07[H05K]
7157646 Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing sameJul 02, 04Jan 02, 07[H05K]
7157647 Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing sameJul 02, 04Jan 02, 07[H05K]
7145221 Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing sameAug 18, 04Dec 05, 06[H01L]
7109732 Electronic component test apparatusJul 31, 03Sep 19, 06[G01R]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7801833 Item identification control methodExpiredDec 22, 03Sep 21, 10[G06Q]
7383629 Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereofExpiredNov 19, 04Jun 10, 08[]
7253502 Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing sameExpiredJul 28, 04Aug 07, 07[H01L]
7152319 Method of making high speed circuit boardExpiredMar 30, 04Dec 26, 06[H01K]
7142121 Radio frequency device for tracking goodsExpiredJun 04, 04Nov 28, 06[G08B]
7084014 Method of making circuitized substrateExpiredOct 07, 03Aug 01, 06[H01L]
7047630 Method of making circuitized substrate assemblyExpiredMar 30, 04May 23, 06[H05K]
7035113 Multi-chip electronic package having laminate carrier and method of making sameExpiredMar 24, 03Apr 25, 06[H05K]
7023707 Information handling systemExpiredMar 24, 03Apr 04, 06[H05K]
6964884 Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing sameExpiredNov 19, 04Nov 15, 05[H01L]
2005/0157,475 Method of making printed circuit board with electroplated conductive through holes and board resulting therefromAbandonedJan 15, 04Jul 21, 05[C25D, H05K]
6828514 High speed circuit board and method for fabricationExpiredJan 30, 03Dec 07, 04[H05K]
2004/0238,970 Electronic pckage with conductive pad capable of withstanding significant loads and information handling system utilizing sameAbandonedJun 16, 04Dec 02, 04[H01L]
2004/0242,270 Electronic cardAbandonedJun 02, 03Dec 02, 04[H04M]

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