VI Chip, Inc.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01F MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 282
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1124
 
  
 
H01H ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES 193

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9387633 Encapsulation method for electronic modulesApr 22, 13Jul 12, 16[H01L, B29C]
9087656 Power supply system with power factor correction and efficient low power operationJun 18, 12Jul 21, 15[H01H]
8427267 Encapsulation method and apparatus for electronic modulesJun 29, 09Apr 23, 13[H01F]
8427269 Encapsulation method and apparatus for electronic modulesJun 29, 09Apr 23, 13[H01F]
8222772 Power supply system with power factor correction and efficient low power operationFeb 08, 10Jul 17, 12[H01N]

Expired/Abandoned/Withdrawn Patents

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Top Inventors for This Owner

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