UTAC HEADQUARTERS PTE. LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 213181
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 7149
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 264
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 2157
 
  
 
B44C PRODUCING DECORATIVE EFFECTS 133
 
  
 
B81B MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES 132
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 135
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 150
 
  
 
F25D REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHER SUBCLASS 145
 
  
 
F28D HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT 144

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0061,667 SEMICONDUCTOR PACKAGE WITH MULTIPLE MOLDING ROUTING LAYERS AND A METHOD OF MANUFACTURING THE SAMENov 03, 17Mar 01, 18[H01L]
2012/0094,438 APPARATUS FOR AND METHODS OF ATTACHING HEAT SLUGS TO PACKAGE TOPSDec 21, 11Apr 19, 12[H01L]
2012/0006,528 METHOD OF AND SYSTEM FOR COOLING A SINGULATION PROCESSSep 16, 11Jan 12, 12[F28D, F28F]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9922843 Semiconductor package with multiple molding routing layers and a method of manufacturing the sameNov 09, 16Mar 20, 18[H01L]
9917038 Semiconductor package with multiple molding routing layers and a method of manufacturing the sameNov 09, 16Mar 13, 18[H01L]
9899208 Molded leadframe substrate semiconductor packageDec 09, 10Feb 20, 18[H01L]
9881863 Semiconductor packages and methods of packaging semiconductor devicesFeb 08, 17Jan 30, 18[H01L]
9842792 Method of producing a semiconductor packageJan 27, 16Dec 12, 17[H01L]
9818676 Singulation method for semiconductor package with plating on side of connectorsApr 26, 16Nov 14, 17[H01L]
9805955 Semiconductor package with multiple molding routing layers and a method of manufacturing the sameNov 09, 16Oct 31, 17[H01L]
9806006 Etch isolation LPCC/QFN stripSep 20, 07Oct 31, 17[H01L, H05K]
9786625 Semiconductor packages and methods of packaging semiconductor devicesJul 20, 15Oct 10, 17[H01L]
9773722 Semiconductor package with partial plating on contact side surfacesMay 07, 15Sep 26, 17[H01L]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
8586465 Through silicon via dies and packagesExpiredJun 05, 08Nov 19, 13[H01L]
8399985 Mold design and semiconductor packageExpiredSep 25, 11Mar 19, 13[H01L]
7642638 Inverted lead frame in substrateExpiredDec 19, 07Jan 05, 10[H01L]
7371610 Process for fabricating an integrated circuit package with reduced mold warpingExpiredNov 16, 04May 13, 08[H01L]
6987032 Ball grid array package and process for manufacturing sameExpiredAug 20, 03Jan 17, 06[H01L]
6968613 Fabrication method of circuit boardExpiredJun 20, 02Nov 29, 05[H01K]
6956741 Semiconductor package with heat sinkExpiredSep 09, 03Oct 18, 05[H05K]
6933178 Method of manufacturing semiconductor packages and a clamping device for manufacturing a semiconductor packageExpiredApr 20, 04Aug 23, 05[H01L]
6933448 Printed circuit board having permanent solder maskExpiredJan 16, 04Aug 23, 05[H05K]
6897566 Encapsulated semiconductor package free of chip carrierExpiredJun 24, 02May 24, 05[H01L]
6857865 Mold structure for package fabricationExpiredJun 20, 02Feb 22, 05[H01L, B29C]
6859056 Test fixture for semiconductor package and test method of using the sameExpiredJun 20, 02Feb 22, 05[G01R]
6849915 Light sensitive semiconductor package and fabrication method thereofExpiredAug 26, 03Feb 01, 05[H01L]
6753480 Printed circuit board having permanent solder maskExpiredMay 24, 02Jun 22, 04[H05K]
6740540 Fabrication method for circuit boardExpiredJun 12, 02May 25, 04[H01L]
6734044 Multiple leadframe laminated IC packageExpiredJun 10, 02May 11, 04[H01L]

Top Inventors for This Owner

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