ULTRATERA CORPORATION

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7080447 Method of manufacturing solder mask of printed circuit boardExpiredMar 16, 04Jul 25, 06[H05K]
2006/0027,901 Stacked chip package with exposed lead-frame bottom surfaceAbandonedAug 09, 04Feb 09, 06[H01L]
2005/0258,552 Semiconductor molding method and structureAbandonedMay 18, 04Nov 24, 05[H01L]
2005/0062,152 Window ball grid array semiconductor package with substrate having opening and mehtod for fabricating the sameAbandonedSep 24, 03Mar 24, 05[H01L]
2005/0062,155 Window ball grid array semiconductor package and method for fabricating the sameAbandonedSep 24, 03Mar 24, 05[H01L]
2005/0046,003 Stacked-chip semiconductor package and fabrication method thereofAbandonedAug 26, 03Mar 03, 05[H01L]
2004/0202,834 Thin-sheet resin-coated carrierAbandonedSep 19, 02Oct 14, 04[B32B]
2004/0194,695 Resin coated carrier fabrication method and the related apparatus for the fabricationAbandonedApr 23, 04Oct 07, 04[B05C]
2004/0124,176 Palsma etchingm methodAbandonedApr 22, 03Jul 01, 04[C03C, C23F, B44C]
2004/0070,083 Stacked flip-chip packageAbandonedAug 26, 03Apr 15, 04[H01L]
2004/0061,222 Window-type ball grid array semiconductor packageAbandonedSep 30, 02Apr 01, 04[H01L]
2004/0047,991 Resin coated carrier fabrication method and the related apparatus for the fabricationAbandonedSep 11, 02Mar 11, 04[B05C, B05D]
2004/0007,386 Structure of printed circuit board (PCB)AbandonedJul 11, 02Jan 15, 04[H05K]
2004/0003,940 Circuit board for flip-chip semiconductor package and fabrication method thereofAbandonedDec 05, 02Jan 08, 04[H05K]
2004/0004,277 Semiconductor package with reinforced substrate and fabrication method of the substrateAbandonedDec 05, 02Jan 08, 04[H01L]
2004/0004,281 Semiconductor package with heat sinkAbandonedOct 04, 02Jan 08, 04[H01L]
2003/0234,276 Strengthened bonding mechanism for semiconductor packageAbandonedJun 20, 02Dec 25, 03[B23K]
2003/0204,949 Method of forming connections on a conductor pattern of a printed circuit boardAbandonedDec 27, 02Nov 06, 03[H05K]
2003/0205,793 Wire-bonded chip on board packageAbandonedMay 23, 02Nov 06, 03[H01L]
2003/0201,544 Flip chip packageAbandonedMay 23, 02Oct 30, 03[H01L]

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