ULTRATECH, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 213181
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 7032
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 2477
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 19186
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 17139
 
  
 
G03B APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR 1186
 
  
 
G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS1089
 
  
 
G01J MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY 573
 
  
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 599
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 5128

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0260,629 Quartz crystal microbalance assembly for ALD systemsFeb 17, 17Sep 14, 17[C23C]
2017/0241,019 PE-ALD METHODS WITH REDUCED QUARTZ-BASED CONTAMINATIONJan 27, 17Aug 24, 17[C23C, H01J]
2017/0194,204 IMPROVED THROUGH SILICON VIAAug 27, 14Jul 06, 17[H01L]
2017/0178,980 Full-wafer inspection methods having selectable pixel densityNov 30, 16Jun 22, 17[H01L, G01N, G01B]
2017/0145,564 VAPOR DELIVERY SYSTEMJan 22, 15May 25, 17[C23C]
2017/0088,952 High-throughput multichamber atomic layer deposition systems and methodsSep 20, 16Mar 30, 17[C23C]
2017/0073,812 Laser-assisted atomic layer deposition of 2D metal chalcogenide filmsSep 06, 16Mar 16, 17[C23C]
2017/0062,191 Plasma-enhanced atomic layer deposition system with rotary reactor tubeAug 23, 16Mar 02, 17[H01J, C23C]
2017/0016,114 PLASMA ATOMIC LAYER DEPOSITION SYSTEM AND METHODSep 27, 16Jan 19, 17[C23C]
2016/0354,865 Microchamber laser processing systems and methods using localized process-gas atmosphereMay 04, 16Dec 08, 16[B23K]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9783888 Atomic layer deposition headDec 02, 15Oct 10, 17[C23C]
9784570 Polarization-based coherent gradient sensing systems and methodsMay 12, 16Oct 10, 17[G01B]
9777371 ALD systems and methodsFeb 26, 10Oct 03, 17[C23C]
9768016 Formation of heteroepitaxial layers with rapid thermal processing to remove lattice dislocationsJun 25, 14Sep 19, 17[C23C, H01L, B23K]
9711361 High-efficiency line-forming optical systems and methods for defect annealing and dopant activationFeb 20, 17Jul 18, 17[H01L, B23K]
9691613 Formation of heteroepitaxial layers with rapid thermal processing to remove lattice dislocationsJun 25, 14Jun 27, 17[C23C, H01L, B23K]
9666432 Method and apparatus for forming device quality gallium nitride layers on silicon substratesSep 17, 14May 30, 17[C23C, H01L, B23K]
9638922 High-efficiency line-forming optical systems and methodsJun 24, 16May 02, 17[H01L, B23K, G02B]
9633850 Masking methods for ALD processes for electrode-based devicesJul 14, 16Apr 25, 17[H01L, H01G]
9613815 High-efficiency line-forming optical systems and methods for defect annealing and dopant activationOct 30, 15Apr 04, 17[H01L, B23K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0240,440 SYSTEMS AND PROCESSES FOR FORMING THREE-DIMENSIONAL INTEGRATED CIRCUITSAbandonedApr 28, 16Aug 18, 16[H01L]
2014/0238,958 Systems and methods for material processing using light-emitting diodesAbandonedFeb 28, 13Aug 28, 14[B23K]
8669660 Solder interconnect pads with current spreading layersExpiredDec 20, 12Mar 11, 14[H01L]
2012/0223,062 Minimization of Surface ReflectivityAbandonedMay 15, 12Sep 06, 12[H01L, B23K]
2012/0141,676 ALD COATING SYSTEMAbandonedOct 14, 11Jun 07, 12[C23C]
2012/0129,336 STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEMICONDUCTOR DEVICESAbandonedJan 27, 12May 24, 12[H01L]
2012/0111,838 Thermal Processing of Substrates with Pre- and Post-Spike Temperature ControAbandonedJan 10, 12May 10, 12[H01L, B23K]
2012/0071,007 SUBSTRATE PROCESSING WITH REDUCED WARPAGE AND/OR CONTROLLED STRAINAbandonedSep 26, 11Mar 22, 12[H01L, G21K]
2012/0012,642 INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERSAbandonedSep 25, 11Jan 19, 12[B23K]
2011/0311,726 METHOD AND APPARATUS FOR PRECURSOR DELIVERYAbandonedJun 17, 11Dec 22, 11[C23C, B05C]
2011/0298,093 Thermal Processing of Substrates with Pre- and Post-Spike Temperature ControlAbandonedAug 15, 11Dec 08, 11[H01L]
2011/0195,543 FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED SOLDER RESIST OPENINGAbandonedApr 21, 11Aug 11, 11[H01L]
2011/0129,996 THROUGH SUBSTRATE ANNULAR VIA INCLUDING PLUG FILLERAbandonedFeb 11, 11Jun 02, 11[H01L]
2011/0089,523 SYSTEMS AND PROCESSES FOR FORMING THREE-DIMENSIONAL CIRCUITSAbandonedDec 21, 10Apr 21, 11[H01L, C30B]
2011/0028,003 Substrate processing with reduced warpage and/or controlled strainAbandonedSep 01, 10Feb 03, 11[H01L, B23K]
7847213 Method and apparatus for modifying an intensity profile of a coherent photonic beamExpiredSep 11, 07Dec 07, 10[H01L, B23K]
2010/0283,978 LED-based UV illuminators and lithography systems using sameAbandonedAug 07, 09Nov 11, 10[G03B, F21S]
2010/0218,891 MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYMER DIELECTRICAbandonedMay 10, 10Sep 02, 10[C09J]
2010/0140,768 Systems and processes for forming three-dimensional circuitsAbandonedDec 10, 08Jun 10, 10[H01L, B23P]
2010/0084,744 Thermal processing of substrates with pre- and post-spike temperature controlAbandonedOct 06, 08Apr 08, 10[H01L, F27D]

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