Tadatomo SUGA

Patent Owner

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 390
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8915418 Electronic component bonding methodMar 13, 14Dec 23, 14[B23K, H05K]
8651363 Joining method and device produced by this method and joining unitNov 16, 11Feb 18, 14[H01L, B23K]
6935553 Reflow soldering methodApr 15, 03Aug 30, 05[B23K]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7183190 Semiconductor device and fabrication method thereforExpiredMar 27, 01Feb 27, 07[H01L]
6777967 Inspection method and inspection apparatusExpiredAug 20, 01Aug 17, 04[G01R]

Top Inventors for This Owner

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