TOUCH MICRO-SYSTEM TECHNOLOGY INC.

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 8354
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 234
 
  
 
C03C CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS159
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 173
 
  
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 1127
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

  • No Recent Publications to Display

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7987588 Interposer for connecting plurality of chips and method for manufacturing the sameNov 19, 08Aug 02, 11[H05K]
7821094 Light emitting diode structureOct 08, 08Oct 26, 10[H01L]
7795131 Method of fabricating metal interconnects and inter-metal dielectric layer thereofMar 12, 07Sep 14, 10[H01L]
7741772 White LED package structure having a silicon substrate and method of making the sameApr 18, 07Jun 22, 10[H01J]
7361284 Method for wafer-level packageJun 23, 06Apr 22, 08[H01B]
7258806 Method of fabricating a diaphragm of a capacitive microphone deviceJun 23, 06Aug 21, 07[C23F]
7045463 Method of etching cavities having different aspect ratiosOct 28, 04May 16, 06[H01L]
7008821 Method of forming a wafer backside interconnecting wireNov 19, 04Mar 07, 06[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7674392 Method of fabricating a hingeExpiredNov 07, 06Mar 09, 10[C03C]
2010/0002,284 METHOD OF MODULATING RESONANT FREQUENCY OF TORSIONAL MEMS DEVICEAbandonedSep 09, 08Jan 07, 10[G02B]
2010/0002,285 TORSIONAL MEMS DEVICEAbandonedAug 31, 08Jan 07, 10[G02B]
7622334 Wafer-level packaging cutting method capable of protecting contact padsExpiredApr 09, 08Nov 24, 09[H01L]
7598125 Method for wafer level packaging and fabricating cap structuresExpiredJun 26, 06Oct 06, 09[H01L]
7585417 Method of fabricating a diaphragm of a capacitive microphone deviceExpiredJun 23, 06Sep 08, 09[C23F]
7582511 Method for wafer level chip scale packaging with passive components integrated into packaging structureExpiredMay 17, 06Sep 01, 09[H01L]
7566574 Method of performing a double-sided processExpiredSep 06, 07Jul 28, 09[H01L]
7533564 Micro sample heating apparatus and method of making the sameExpiredMay 02, 06May 19, 09[G01F]
7531457 Method of fabricating suspended structureExpiredNov 21, 06May 12, 09[H01L]
7528000 Method of fabricating optical device capsExpiredApr 16, 07May 05, 09[H01L]
7514287 Method of forming a cavity by two-step etching and method of reducing dimension of a MEMS deviceExpiredMar 15, 06Apr 07, 09[H01L]
7510892 Light emitting diode structure and manufacturing method thereofExpiredApr 18, 07Mar 31, 09[H01L]
7510947 Method for wafer level packaging and fabricating cap structuresExpiredJul 03, 06Mar 31, 09[H01L]
7505118 Wafer carrierExpiredOct 12, 04Mar 17, 09[H01L, G03B]
2009/0023,364 METHOD OF MAKING A WAFER HAVING AN ASYMMETRIC EDGE PROFILEAbandonedSep 18, 08Jan 22, 09[B24B]
7470565 Method of wafer level packaging and cuttingExpiredJun 28, 06Dec 30, 08[H01L]
7465601 Method of forming suspended structureExpiredApr 18, 07Dec 16, 08[H01L]
7456043 Method of fabricating microphone device and thermal oxide layer and low-stress structural layer thereofExpiredMar 15, 06Nov 25, 08[H01L]
7432208 Method of manufacturing suspension structureExpiredAug 01, 06Oct 07, 08[H01L]

View all patents..

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.