TONGFU MICROELECTRONICS CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 26336
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 5154
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2154
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0189,983 METHOD AND STRUCTURE FOR FAN-OUT WAFER LEVEL PACKAGINGDec 21, 15Jun 30, 16[H01L]
2016/0190,028 METHOD AND STRUCTURE FOR FAN-OUT WAFER LEVEL PACKAGINGDec 21, 15Jun 30, 16[H01L]
2016/0172,313 SUBSTRATE WITH A SUPPORTING PLATE AND FABRICATION METHOD THEREOFDec 14, 15Jun 16, 16[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9922950 Method and structure for wafer-level packagingMar 10, 17Mar 20, 18[H01L]
9837371 Structure and method of reinforcing a conductor soldering point of semiconductor deviceNov 07, 14Dec 05, 17[H01L]
9761549 Semiconductor device and fabrication methodNov 07, 13Sep 12, 17[H01L]
9666550 Method and structure for wafer-level packagingDec 16, 15May 30, 17[H01L]
9620468 Semiconductor packaging structure and method for forming the sameNov 07, 13Apr 11, 17[H01L]
9595490 3D system-level packaging methods and structuresMar 22, 12Mar 14, 17[H01L]
9589815 Semiconductor IC packaging methods and structuresNov 07, 13Mar 07, 17[H01L]
9543269 System-level packaging methods and structuresMar 22, 12Jan 10, 17[H01L]
9515010 Semiconductor packaging structure and forming method thereforJun 26, 14Dec 06, 16[H01L]
9502337 Flip-chip on leadframe semiconductor packaging structure and fabrication method thereofOct 29, 15Nov 22, 16[H01L]

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