TOHTO KASEI CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM5152
 
  
 
C08G MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 4116
 
  
 
C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS 3113

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8057902 Epoxy phosphorous-containing resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin compositionMar 04, 08Nov 15, 11[C08G, C08L, B32B]
7906562 Epoxy resin, epoxy resin composition containing the epoxy resin as an essential component and a cured product containing the epoxy resin as an essential componentDec 21, 07Mar 15, 11[C08G]
7858173 Thermoplastic polyhydroxy polyether resin and resin composition comprising the sameMar 24, 08Dec 28, 10[B32B]
7332557 Epoxy resin, epoxy resin composition thereof and cured product thereofJan 13, 04Feb 19, 08[B32B]
7268192 Process for producing high-purity epoxy resin and epoxy resin compositionFeb 16, 04Sep 11, 07[C08L]
6933050 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer boardFeb 06, 03Aug 23, 05[C08L, B32B]
6524709 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer boardOct 12, 00Feb 25, 03[C08G, C08L, B32B]
5837799 Fire-retardant compound, a process for producing said fire-retardant compound and a fire-retarded thermoplastic resin composition including said fire-retardant compoundAug 23, 96Nov 17, 98[C08G]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2010/0184,923 EPOXY RESIN COMPOSITIONAbandonedJun 12, 08Jul 22, 10[C08G]
2007/0027,302 Method of crystallizing organic oligomer, epoxy resin composition containing organic oligomer obtained by the method and epoxy resin cured materialAbandonedMay 07, 04Feb 01, 07[B01D]
6762251 Thermoplastic polyhydroxypolyether resin and an insulation film produced therefromExpiredSep 04, 02Jul 13, 04[C08G]
6566414 Curing method to cure epoxy resins in a short time, and a method for absorbing electromagnetic wave through cured epoxy resins obtained by said curing methodExpiredJul 06, 01May 20, 03[C08F]
6517743 Epoxy resin composition having high neutron shielding ability, and a transparent shielding materials for neutron obtained by curing said epoxy resin compositionExpiredMar 20, 01Feb 11, 03[G21C]
6248432 Ink jet recording sheetExpiredOct 09, 97Jun 19, 01[B32B]
6169159 Alcohol-blocked brominated bisphenol a epoxy resin flame retardants for carbonyl-containing thermoplastic resinsExpiredFeb 20, 98Jan 02, 01[C08L, C08K]
4463134 Modified epoxy resin compositionExpiredDec 22, 81Jul 31, 84[C08F, C08L]
4447579 Epoxy resin adhesive compositionsExpiredApr 20, 82May 08, 84[C08F, C08L]
4371665 Modified epoxy resin compositionExpiredDec 22, 81Feb 01, 83[C08L]

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