TECHNIC, INC.
Patent Owner
Stats
- 18 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Jan 09, 2018 most recent publication
Details
- 18 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 4,617 Total Citation Count
- Jul 10, 1978 Earliest Filing
- 120 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
9864345 Eliminating temperature variation effects to improve accuracy of electroplating bath monitoringDec 18, 14Jan 09, 18[G01N, G05B]
8440065 Electrolyte composition, method, and improved apparatus for high speed tin-silver electroplatingJun 04, 10May 14, 13[C25D]
7270733 Method and apparatus for real time monitoring of industrial electrolytesJul 16, 03Sep 18, 07[G06N]
7124120 Method and apparatus for real time monitoring of electroplating bath performance and early fault detectionJul 16, 03Oct 17, 06[G06N]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2013/0252,020 Electro-Depositing Metal Layers of Uniform ThicknessAbandonedDec 06, 11Sep 26, 13[C25D, B32B]
2009/0120,497 METHOD OF METALLIZING SOLAR CELL CONDUCTORS BY ELECTROPLATING WITH MINIMAL ATTACK ON UNDERLYING MATERIALS OF CONSTRUCTIONAbandonedNov 07, 08May 14, 09[C25D, H01L]
2009/0090,633 ELECTROPLATING SYSTEM WITH MOVABLE SUPPORT STRUCTURE PROVIDING CATHODE POTENTIALAbandonedOct 06, 08Apr 09, 09[C25D]
2009/0090,632 ELECTROPLATING SYSTEM INCLUDING INTERCHANGEABLE CARRIERS FOR SUPPORTING AND PROVIDING CATHODE POTENTIAL TO ARTICLESAbandonedOct 06, 08Apr 09, 09[C25D]
7270734 Near neutral pH cleaning/activation process to reduce surface oxides on metal surfaces prior to electroplatingExpiredJun 04, 04Sep 18, 07[C25D]
2007/0114,125 System and method for electroplating flexible substratesAbandonedNov 18, 05May 24, 07[C25D]
2007/0007,144 Tin electrodeposits having properties or characteristics that minimize tin whisker growthAbandonedJun 23, 06Jan 11, 07[C25D]
2006/0292,847 Silver barrier layers to minimize whisker growth in tin electrodepositsAbandonedJun 23, 06Dec 28, 06[H01L]
2006/0237,324 Pulse plating process for deposition of gold-tin alloyAbandonedJun 21, 06Oct 26, 06[C25D]
2006/0240,276 Underlayer for reducing surface oxidation of plated depositsAbandonedApr 19, 06Oct 26, 06[C25D, B32B]
2006/0219,562 System and method of transporting and providing a cathode contact to articles in an electroplating systemAbandonedApr 01, 05Oct 05, 06[C25D]
2006/0219,563 System and method of controlling the demarcation line formed on partially electroplated articlesAbandonedApr 01, 05Oct 05, 06[C23C, C25D, C23F]
2006/0163,080 Pulse plating process for deposition of gold-tin alloyAbandonedJan 19, 06Jul 27, 06[C25D]
2006/0016,692 Reduction of surface oxidation during electroplatingAbandonedSep 23, 05Jan 26, 06[C23C, C25D]
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