TANAKA DENSHI KOGYO K.K.

Patent Owner

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C22C ALLOYS 567
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 4358
 
  
 
B21C MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PROFILES OR LIKE SEMI-MANUFACTURED PRODUCTS OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL219
 
  
 
B21D WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING 155
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
  
 
C22F CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS 136
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1100
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 150
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 173

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0125,135 NOBLE METAL-COATED COPPER WIRE FOR BALL BONDINGOct 28, 16May 04, 17[H01L, H01B]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9362249 Silver—gold alloy bonding wireFeb 11, 15Jun 07, 16[H01L]
9103001 Ag—Au—Pd ternary alloy bonding wireNov 01, 11Aug 11, 15[H01L, B21C, C22C]
8440137 Au bonding wire for semiconductor deviceNov 22, 05May 14, 13[H01L, C22C]
6213382 Method for making a bumpJan 05, 99Apr 10, 01[B21D]
6159420 Gold alloy wire and method for making a bumpMay 23, 97Dec 12, 00[C22C]
5702814 Gold wire for bondingJan 17, 96Dec 30, 97[C22C]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0164,559 ALUMINUM RIBBON FOR ULTRASONIC BONDINGAbandonedSep 09, 10Jun 27, 13[C22C]
2012/0312,428 HIGH STRENGTH AND HIGH ELONGATION RATIO OF AU ALLOY BONDING WIREAbandonedJun 10, 11Dec 13, 12[C22C]
8147750 Gold alloy wire for ball bondingExpiredJun 23, 08Apr 03, 12[B22D, H01F, H02G, C22C]
2011/0236,697 ALUMINUM FOR ULTRASONIC BONDINGAbandonedNov 05, 10Sep 29, 11[B32B]
2011/0058,979 BONDING WIREAbandonedSep 11, 08Mar 10, 11[C22C]
7857189 Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistanceExpiredJun 08, 06Dec 28, 10[B23K]
2010/0314,156 AU ALLOY WIRE FOR BALL BONDINGAbandonedOct 15, 08Dec 16, 10[H01B]
2010/0171,222 HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF SAMEAbandonedMar 26, 08Jul 08, 10[H01L, H01B]
7678999 Gold alloy wire for bonding wire having high bonding reliability, high roundness of compression ball, high straightness and high resin flowability resistanceExpiredJun 08, 06Mar 16, 10[H01B]
2009/0232,695 GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH INITIAL BONDABILITY, HIGH BONDING RELIABILITY, HIGH ROUNDNESS OF COMPRESSION BALL, HIGH STRAIGHTNESS, HIGH RESIN FLOWABILITY RESISTANCE, AND LOW SPECIFIC RESISTANCEAbandonedJun 08, 06Sep 17, 09[C22C]
2008/0075,626 Wire Bump MaterialAbandonedSep 29, 05Mar 27, 08[C22C]
2008/0050,267 Au Alloy Bonding WireAbandonedSep 28, 05Feb 28, 08[C22C]
6492593 Gold wire for semiconductor element connection and semiconductor element connection methodExpiredMay 31, 01Dec 10, 02[H01R]
6241094 Spool case of bonding wireExpiredAug 07, 98Jun 05, 01[B65D]
6160224 Solder material and electronic part using the sameExpiredMay 12, 98Dec 12, 00[H05K]
5945065 Method for wedge bonding using a gold alloy wireExpiredJul 28, 97Aug 31, 99[C22C]
5550407 Semiconductor device having an aluminum alloy wiring lineExpiredJul 29, 94Aug 27, 96[H01L, C22C]
5538685 Palladium bonding wire for semiconductor deviceExpiredMay 30, 95Jul 23, 96[C22C]
5384090 Fine wire for forming bump electrodes using a wire bonderExpiredOct 30, 92Jan 24, 95[C22C]
5366692 Alloy connecting materials for semiconductorsExpiredNov 28, 90Nov 22, 94[C22C]

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