TAMURA KAKEN CORPORATION
Patent Owner
Stats
- 1 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- May 06, 2010 most recent publication
Details
- 1 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 101 Total Citation Count
- Dec 20, 1993 Earliest Filing
- 15 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
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Recent Publications
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Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2010/0112,361 Method of removing lead, reclaimed metals and reclaimed productsAbandonedOct 30, 09May 06, 10[C22B, B32B]
2008/0191,347 CONDUCTIVE BALL-OR PIN-MOUNTED SEMICONDUCTOR PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND CONDUCTIVE BONDING MATERIALAbandonedJan 28, 08Aug 14, 08[H01L, C22C]
2005/0197,425 Thermosetting resin compositions, resin films and film articlesAbandonedMar 01, 05Sep 08, 05[B32B]
2005/0181,215 Thermosetting resin compositions and film articlesAbandonedJan 21, 05Aug 18, 05[C08L, B32B]
2005/0173,678 Surface treatment agents for metal films of printed circuit boardsAbandonedJan 18, 05Aug 11, 05[C09K, H05K]
2004/0211,291 Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder compositionAbandonedApr 02, 04Oct 28, 04[B22F]
2004/0001,961 Curable resin composition useful for coating, multi-layer printed wiring board, printed wiring board and dry filmAbandonedMay 06, 03Jan 01, 04[B32B]
2003/0064,304 Photosensitive resin composition and printed wiring boardAbandonedSep 17, 02Apr 03, 03[G03F]
2003/0064,305 Photosensitive resin composition and printed wiring boardAbandonedSep 17, 02Apr 03, 03[G03F]
2003/0047,034 Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder compositionAbandonedMar 26, 02Mar 13, 03[B22F]
6475701 Active energy beam curable composition and printed wiring boardExpiredFeb 12, 01Nov 05, 02[C08F, C03F]
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