TAMURA KAKEN CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 135

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
5735973 Printed circuit board surface protective agentDec 20, 93Apr 07, 98[C23F]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2010/0112,361 Method of removing lead, reclaimed metals and reclaimed productsAbandonedOct 30, 09May 06, 10[C22B, B32B]
2008/0191,347 CONDUCTIVE BALL-OR PIN-MOUNTED SEMICONDUCTOR PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND CONDUCTIVE BONDING MATERIALAbandonedJan 28, 08Aug 14, 08[H01L, C22C]
2005/0197,425 Thermosetting resin compositions, resin films and film articlesAbandonedMar 01, 05Sep 08, 05[B32B]
2005/0181,215 Thermosetting resin compositions and film articlesAbandonedJan 21, 05Aug 18, 05[C08L, B32B]
2005/0173,678 Surface treatment agents for metal films of printed circuit boardsAbandonedJan 18, 05Aug 11, 05[C09K, H05K]
2004/0211,291 Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder compositionAbandonedApr 02, 04Oct 28, 04[B22F]
6756166 Photosensitive resin composition and printed wiring boardExpiredSep 23, 02Jun 29, 04[G03F]
2004/0001,961 Curable resin composition useful for coating, multi-layer printed wiring board, printed wiring board and dry filmAbandonedMay 06, 03Jan 01, 04[B32B]
2003/0177,865 Process of producing metal powdersAbandonedMar 11, 03Sep 25, 03[B22F]
2003/0064,304 Photosensitive resin composition and printed wiring boardAbandonedSep 17, 02Apr 03, 03[G03F]
2003/0064,305 Photosensitive resin composition and printed wiring boardAbandonedSep 17, 02Apr 03, 03[G03F]
2003/0047,034 Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder compositionAbandonedMar 26, 02Mar 13, 03[B22F]
6475701 Active energy beam curable composition and printed wiring boardExpiredFeb 12, 01Nov 05, 02[C08F, C03F]
2001/0045,244 Soldering flux for circuit board and circuit boardAbandonedApr 23, 01Nov 29, 01[B23K]
5468784 Photopolymerizable resin compositionExpiredFeb 23, 94Nov 21, 95[C08F, C03F]

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