TAISEI CORPORATION
Patent Owner
Stats
- 15 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Dec 12, 2017 most recent publication
Details
- 15 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 856 Total Citation Count
- Apr 25, 1978 Earliest Filing
- 72 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
8137453 Fiber reinforced concrete and method of manufacturing fiber reinforced concrete memberMay 12, 05Mar 20, 12[C04B]
7640864 Non-magnetic concrete structure, a sidewall for a guideway and a method for installing such a sidewall for the guidewayApr 19, 05Jan 05, 10[B60L]
7294375 Cement composite, concrete, concrete cask and method of manufacturing concreteJul 18, 03Nov 13, 07[B28B]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
7420118 Electric wire and cable with coating/covering of polyvinyl chloride family resin compositionExpiredApr 25, 05Sep 02, 08[H01B]
2008/0011,002 Air Conditioning System For Rooms Required To Be SterilizedAbandonedMay 02, 05Jan 17, 08[F24F, A61L]
7000419 High-efficiency gas temperature/humidity controlling device and controlling methodExpiredSep 11, 00Feb 21, 06[F24F]
6929985 Air filter, method of manufacturing air filter, local facility, clean room, treating agent, and method of manufacturing filter mediumExpiredMar 08, 02Aug 16, 05[H01L, B01D]
6903264 Electric wire coated with polyvinyl chloride resin composition and cableExpiredMay 23, 02Jun 07, 05[H01B]
6883283 Semiconductor manufacturing facility and a semiconductor manufacturing methodExpiredMar 22, 02Apr 26, 05[E02D]
6799539 System and method for utilization of waste heat of semiconductor equipment and heat exchanger used for utilization of waste heat of semiconductor equipmentExpiredAug 19, 03Oct 05, 04[F22D]
6752873 Apparatus for producing coating layer onto primary liningExpiredJun 16, 03Jun 22, 04[B05C, B05B]
2004/0069,448 Exhaust heat utilization system, exhaust heat utilization method, and semiconductor production facilityAbandonedAug 19, 03Apr 15, 04[F24H, F25B, F27D]
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