TAICHI HOLDINGS, LLC

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 6356
 
  
 
H02H EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS 374
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 2445
 
  
 
G06T IMAGE DATA PROCESSING OR GENERATION, IN GENERAL 2133
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2154

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8520016 Instruction folding mechanism, method for performing the same and pixel processing system employing the sameMar 09, 09Aug 27, 13[G06T, G06F]
7502029 Instruction folding mechanism, method for performing the same and pixel processing system employing the sameJan 17, 06Mar 10, 09[G06T, G06F]
7397642 ESD protection circuitNov 17, 05Jul 08, 08[H02H]
7307844 Heat dissipation mechanism for electronic apparatusFeb 11, 05Dec 11, 07[H05K]
6933600 Substrate for semiconductor packageMay 20, 02Aug 23, 05[H01L]
6885534 Electrostatic discharge protection device for giga-hertz radio frequency integrated circuits with varactor-LC tanksOct 21, 02Apr 26, 05[H02H]
6765301 Integrated circuit bonding device and manufacturing method thereofAug 06, 02Jul 20, 04[H01L]
6747350 Flip chip package structureJun 06, 03Jun 08, 04[H01L]
6744107 ESD protection circuit with self-triggered techniqueDec 23, 02Jun 01, 04[H01L]
6707677 Chip-packaging substrate and test method thereforMar 12, 03Mar 16, 04[H05K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2012/0188,239 INTRUCTION FOLDING MECHANISM, METHOD FOR PERFORMING THE SAME AND PIXEL PROCESSING SYSTEM EMPLOYING THE SAMEAbandonedApr 02, 12Jul 26, 12[G06T]
7288449 Method of manufacturing an ESD protection device with the same mask for both LDD and ESD implantationExpiredNov 25, 05Oct 30, 07[H01L]
7049659 Method of manufacturing an ESD protection device with the same mask for both LDD and ESD implantationExpiredSep 10, 03May 23, 06[H01L]
2006/0027,873 Method of manufacturing an ESD protection device with the same mask for both LDD and ESD implantationAbandonedOct 03, 05Feb 09, 06[H01L]
6653574 Multi-layered substrate with a built-in capacitor design and a method of making the sameExpiredAug 23, 01Nov 25, 03[H05K]
6524942 Bond pad structure and its method of fabricatingExpiredJan 28, 02Feb 25, 03[H01L]
6395996 Multi-layered substrate with a built-in capacitor designExpiredMay 16, 00May 28, 02[H05K]

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