Super Silicon Crystal Research Institute Corp.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 165
 
  
 
B28B SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER 127
 
  
 
B28D WORKING STONE OR STONE-LIKE MATERIALS 121
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1361

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
6343980 Flattening machineNov 01, 99Feb 05, 02[B24B]
6178961 Wire saw control method and wire sawJan 27, 00Jan 30, 01[B28D]
6004405 Wafer having a laser mark on chamfered edgeMar 09, 98Dec 21, 99[H01L]
5993292 Production of notchless waferMar 09, 98Nov 30, 99[B28B]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6863735 Epitaxial growth furnaceExpiredFeb 21, 01Mar 08, 05[C23C, H01L, B65G, C23F]
6578589 Apparatus for manufacturing semiconductor waferExpiredSep 24, 01Jun 17, 03[B08B]
2003/0100,455 Aqueous grinding fluid for wire-sawing or band-sawingAbandonedMay 12, 00May 29, 03[C10M]
2003/0011,119 Quartz coil spring and method of producing the sameAbandonedAug 06, 02Jan 16, 03[F16F]
6422067 Slurry useful for wire-saw slicing and evaluation of slurryExpiredAug 11, 00Jul 23, 02[G01N, B23D]
6423137 Single crystal material supplying apparatus and single crystal material supplying methodExpiredNov 05, 99Jul 23, 02[C30B]
6372040 Single crystal growth apparatus and single crystal growth methodExpiredOct 06, 00Apr 16, 02[G30B]
6361597 Single crystal material auxiliary melting apparatus and single crystal material melting methodExpiredNov 05, 99Mar 26, 02[C30B]
6323140 Method of manufacturing semiconductor waferExpiredFeb 26, 01Nov 27, 01[H01L]
6261166 Wire cleaning apparatusExpiredJan 11, 00Jul 17, 01[B28D]
6262393 Epitaxial growth furnaceExpiredOct 16, 00Jul 17, 01[F27B]
6245152 Method and apparatus for producing epitaxial waferExpiredJun 30, 97Jun 12, 01[C23C, H05H]
6237585 Wire-sawing machineExpiredJan 21, 00May 29, 01[B28D]
6234160 Abnormality transmission system for wire sawExpiredJan 27, 00May 22, 01[B28D]
6228167 Single crystal pulling apparatusExpiredMay 09, 99May 08, 01[C30B]
6217648 Single crystal pull-up apparatus and single crystal pull-up methodExpiredApr 21, 99Apr 17, 01[G30B]
6196901 Method of double-side lapping a wafer and an apparatus thereforExpiredAug 13, 99Mar 06, 01[B24B]
6165054 Double side grinding apparatus and double side polishing apparatusExpiredFeb 18, 99Dec 26, 00[B24B]
6163015 Substrate support elementExpiredJul 21, 99Dec 19, 00[A21B]
6117234 Single crystal growing apparatus and single crystal growing methodExpiredMar 10, 98Sep 12, 00[C30B]

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