St Assembly Test Services Pte Ltd

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 26336
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 9150
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 5151
 
  
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 256
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1124
 
  
 
B44C PRODUCING DECORATIVE EFFECTS 133
 
  
 
B65B MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING 163
 
  
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 1205
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 1132

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

  • No Recent Publications to Display

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7446408 Semiconductor package with heat sinkJun 16, 03Nov 04, 08[H01L]
6875634 Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the sameMar 18, 04Apr 05, 05[H01L]
6876069 Ground plane for exposed packageJun 16, 03Apr 05, 05[H01L]
6841858 Leadframe for die stacking applications and related die stacking conceptsSep 27, 02Jan 11, 05[H01L]
6834658 PBGA singulated substrate for model melamine cleaningSep 06, 02Dec 28, 04[B08B]
6828671 Enhanced BGA grounded heatsinkDec 19, 02Dec 07, 04[H01L]
6825067 Mold cap anchoring method for molded flex BGA packagesDec 10, 02Nov 30, 04[H01L]
6818981 Heat spreader interconnect for thermally enhanced PBGA packagesJan 26, 04Nov 16, 04[H01L]
6802445 Cost effective substrate fabrication for flip-chip packagesOct 24, 02Oct 12, 04[B23K]
6791346 Testing of BGA and other CSP packages using probing techniquesMay 08, 02Sep 14, 04[G01R]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6718608 Multi-package conversion kit for a pick and place handlerExpiredJan 22, 02Apr 13, 04[B23P]
6710438 Enhanced chip scale package for wire bond diesExpiredFeb 19, 02Mar 23, 04[H01L]
6604395 Semi-automated probe benderExpiredJul 23, 01Aug 12, 03[B21C, B21D]
6433564 BGA device positioner kitExpiredJun 14, 99Aug 13, 02[G01R]
6383303 High volume fluid headExpiredDec 20, 99May 07, 02[C23G]
6372553 Disposable mold runner gate for substrate based electronic packagesExpiredMay 18, 98Apr 16, 02[H01L]
6282812 Multi air-knife box and method of useExpiredDec 20, 99Sep 04, 01[F26B]

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.