Shimizu Co., Ltd.

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6773247 Die used for resin-sealing and molding an electronic componentExpiredNov 02, 00Aug 10, 04[B29C]
6232364 Ultraviolet curable coating compositions for cationic electrodeposition applicable to metallic materials and electrically conductive plastic materialsExpiredFeb 18, 99May 15, 01[C08F]
5160422 Bath for immersion plating tin-lead alloysExpiredMay 29, 90Nov 03, 92[C25D]

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