Semigear, Inc.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 16346
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 489
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 3156
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 3153
 
  
 
B65G TRANSPORT OR STORAGE DEVICES, e.g. CONVEYERS FOR LOADING OR TIPPING; SHOP CONVEYER SYSTEMS; PNEUMATIC TUBE CONVEYERS 265
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1100
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 135

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2013/0175,323 Serial thermal linear processor arrangementSep 17, 12Jul 11, 13[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9824998 Device packaging facility and method, and device processing apparatus utilizing DEHTJul 27, 16Nov 21, 17[H01L, G01R]
9741683 Device packaging facility and method, and device processing apparatus utilizing phthalateJul 28, 16Aug 22, 17[H01L, B23K, G01R]
9629258 Reflow treating unit and substrate treating apparatusDec 28, 15Apr 18, 17[H01L, B23K, H05K]
9572266 Reflow treating unit and substrate treating apparatusDec 28, 15Feb 14, 17[H01L, B23K, H05K]
9472531 Device packaging facility and method, and device processing apparatus utilizing phthalateFeb 06, 15Oct 18, 16[H01L, G01R]
9226407 Reflow treating unit and substrate treating apparatusAug 01, 13Dec 29, 15[B23K, H05K]
8524593 Arrangement for solder bump formation on wafersJul 19, 11Sep 03, 13[H01L]
8274161 Flux-free chip to substrate joint serial linear thermal processor arrangementJan 07, 11Sep 25, 12[H01L]
8252678 Flux-free chip to wafer joint serial thermal processor arrangementDec 31, 10Aug 28, 12[H01L]
7982320 Arrangement for solder bump formation on wafersDec 14, 09Jul 19, 11[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0034,699 Reflow treating unit & substrate treating apparatusAbandonedAug 01, 13Feb 05, 15[H01L]
2015/0034,702 Apparatus & method for treating substrateAbandonedAug 01, 13Feb 05, 15[H01L]

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