Sankyo Kasei Co., Ltd.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1124
 
  
 
C07D HETEROCYCLIC COMPOUNDS 1161
 
  
 
H01K ELECTRIC INCANDESCENT LAMPS 121
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1361
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9209409 Naphthobisthiadiazole derivativeFeb 27, 13Dec 08, 15[H01L, C07F, C07D]
6588099 Process for manufacturing molded circuit boardJan 22, 01Jul 08, 03[H01K]
6036901 Process for producing electronic partsDec 17, 97Mar 14, 00[B29C]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
8528202 Method for manufacturing a three dimensional circuit boardExpiredFeb 17, 05Sep 10, 13[H05K]
2012/0107,522 METHOD FOR PRODUCING FORMED CIRCUIT COMPONENTAbandonedJul 06, 10May 03, 12[B05D, H05K]
2009/0123,702 Molded circuit component and process for producing the sameAbandonedSep 08, 06May 14, 09[B05D, B32B]
2009/0000,951 Method for Forming Electroconductive CircuitAbandonedJan 23, 07Jan 01, 09[C25D, B05D]
7452217 Connecting member for surface mounting circuitExpiredJun 22, 06Nov 18, 08[H01R]
6498115 Method for manufacturing circuit componentExpiredJul 09, 01Dec 24, 02[H01L]
6015523 Process for producing electronic partsExpiredDec 18, 97Jan 18, 00[B29C]
5551858 Apparatus for forming synthetic resinsExpiredSep 01, 94Sep 03, 96[B29C]
5492658 Gate-cut and ejection control apparatus and control method for an injection molding machineExpiredDec 19, 94Feb 20, 96[B29C]
5460508 Resin molding method and apparatusExpiredApr 12, 94Oct 24, 95[B29C]
5198064 Process for preparing a permeable adhesive tapeExpiredMay 08, 90Mar 30, 93[B05D, A61L]
5173088 Process for preparing crystals of anhydrous sodium sulfideExpiredMay 26, 89Dec 22, 92[C01B]
5057650 Molded circuit component unit for connecting lead wiresExpiredAug 02, 90Oct 15, 91[H02G]
5045641 Moulded electrical connector and method for manufacturing sameExpiredJan 23, 90Sep 03, 91[H01R, H02G]
5015519 Molded article with partial metal plating and a process for producing such articleExpiredOct 16, 89May 14, 91[B32B]
4908043 Method of producing crystals of anhydrous sodium sulfideExpiredJun 23, 88Mar 13, 90[C01B, C01D]
4908259 Molded article with partial metal plating and a process for producing such articleExpiredApr 13, 88Mar 13, 90[B32B]
4812353 Process for the production of circuit board and the likeExpiredOct 15, 87Mar 14, 89[B05C]
4812275 Process for the production of molded articles having partial metal platingExpiredOct 15, 87Mar 14, 89[B29C]
4789413 Process for preparing a gas permeable adhesive tapeExpiredJun 10, 86Dec 06, 88[C09J, B29D, B32B]

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