STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 14348
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
  
 
B23P OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 155
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 135
 
  
 
H01F MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 183
 
  
 
H02K DYNAMO-ELECTRIC MACHINES 1106

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9905436 Wafer level fan-out package and method for manufacturing the sameFeb 25, 16Feb 27, 18[H01L]
9905551 Method of manufacturing wafer level packaging including through encapsulation viasJul 15, 15Feb 27, 18[H01L]
9466586 Method for manufacturing wafer-level fan-out packageJul 08, 15Oct 11, 16[H01L]
9449911 Fan-out wafer level package and manufacturing method thereofJul 16, 15Sep 20, 16[H01L]
9349667 Method of manufacturing stacked packageApr 17, 14May 24, 16[H01L]
9024452 Semiconductor package comprising an interposer and method of manufacturing the sameMay 24, 12May 05, 15[H01L]
8952514 Semiconductor packageApr 27, 12Feb 10, 15[H01L]
8941225 Integrated circuit package and method for manufacturing the sameJul 01, 13Jan 27, 15[H01L]
8912662 Wafer-level package and method of manufacturing the sameJan 30, 13Dec 16, 14[H01L]
8802498 Method of manufacturing semiconductor package having no chip padMar 18, 13Aug 12, 14[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0365,195 METHOD FOR MANUFACTURING VOICE COILAbandonedJul 09, 15Dec 15, 16[H01F]
2015/0243,535 CLUSTER TYPE SEMICONDUCTOR PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAMEAbandonedJul 18, 14Aug 27, 15[C23C, H01J, H01L]
2014/0332,940 Quad Flat No-Lead Integrated Circuit Package and Method for Manufacturing the PackageAbandonedJul 01, 13Nov 13, 14[H01L]
2014/0097,530 INTEGRATED CIRCUIT PACKAGEAbandonedFeb 28, 13Apr 10, 14[H01L]
2013/0319,731 PRINTED CIRCUIT BOARD OF SEMICONDUCTOR PACKAGE FOR DECREASING NOISE BY ELECTROMAGNETIC INTERFERENCEAbandonedMar 18, 13Dec 05, 13[H05K]
2013/0084,678 Method Of Manufacturing Package-On-Package (Pop)AbandonedSep 26, 12Apr 04, 13[H01L]
2012/0313,233 Semiconductor Package, Stacking Semiconductor Package, And Method Of Fabricating The SameAbandonedMay 21, 12Dec 13, 12[H01L]
2011/0089,553 STACK-TYPE SOLID-STATE DRIVEAbandonedDec 15, 09Apr 21, 11[H01L]
2011/0051,352 Stacking-Type USB Memory Device And Method Of Fabricating The SameAbandonedSep 01, 10Mar 03, 11[G06F]
2005/0079,738 USB storage device including USB plug with top and bottom terminalsAbandonedAug 23, 04Apr 14, 05[H01R]

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