STMICROELECTRONICS PVT. LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 74288
 
  
 
H03K PULSE TECHNIQUE 4190
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 28419
 
  
 
G11C STATIC STORES 28123
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 14145
 
  
 
H03L AUTOMATIC CONTROL, STARTING, SYNCHRONISATION, OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES 1466
 
  
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 13193
 
  
 
H03B GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS 756
 
  
 
H04N PICTORIAL COMMUNICATION, e.g. TELEVISION 7235
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 6150

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0017,513 MINIATURE GAS ANALYZERJul 18, 16Jan 18, 18[G01N]
2017/0263,565 INTEGRATED CIRCUIT (IC) PACKAGE WITH A GROUNDED ELECTRICALLY CONDUCTIVE SHIELD LAYER AND ASSOCIATED METHODSMar 14, 16Sep 14, 17[H01L]
2017/0186,674 SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SAMEFeb 09, 16Jun 29, 17[H01L]
2016/0293,512 ELECTRONIC DEVICE WITH DUMMY IC DIE AND RELATED METHODSMar 31, 15Oct 06, 16[H01L]
2016/0184,938 CORED SOLDER WIRE WITH ROSIN FLUX AND THERMOSET MATERIALDec 30, 14Jun 30, 16[B23K]
2016/0187,483 MOLDED PROXIMITY SENSORMar 31, 15Jun 30, 16[H01L, G01S, H01S]
2016/0047,774 COMPACT MICROELECTRONIC INTEGRATED GAS SENSORAug 18, 14Feb 18, 16[G01N, H05K]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9918667 Flexible electrochemical micro-sensorMar 07, 14Mar 20, 18[G01N, A61B]
9911890 Optical sensor package including a cavity formed in an image sensor dieJun 30, 16Mar 06, 18[H01L, H01S, H01G]
9851328 Compact microelectronic integrated gas sensorAug 18, 14Dec 26, 17[G01N, H05K]
9831357 Semiconductor optical package and methodMay 31, 13Nov 28, 17[H01L]
9824924 Semiconductor packages having an electric device with a recessMar 29, 13Nov 21, 17[H01L, B81B]
9818937 Durable miniature gas composition detector having fast response timeDec 29, 15Nov 14, 17[H01L, G01N]
9810653 Integrated SMO gas sensor moduleJul 17, 14Nov 07, 17[G01N]
9793427 Air venting on proximity sensorJul 25, 16Oct 17, 17[H01L, G01V]
9780080 Method for making an optical proximity sensor by attaching an optical element to a package top plate and forming a package body to define an optical transmit cavity and an optical receive cavityOct 09, 14Oct 03, 17[H03K, H01L, G06F]
9768216 Image sensor device with different width cell layers and related methodsNov 07, 14Sep 19, 17[H01L, G03B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0186,644 METHOD FOR MAKING AN INTEGRATED CIRCUIT (IC) PACKAGE WITH AN ELECTRICALLY CONDUCTIVE SHIELD LAYERAbandonedDec 29, 15Jun 29, 17[H01L]
2016/0104,805 OPTICAL SEMICONDUCTOR DEVICE INCLUDING BLACKENED TARNISHABLE BOND WIRES AND RELATED METHODSAbandonedOct 13, 14Apr 14, 16[H01L]
2015/0332,995 ELECTRONIC DEVICE INCLUDING COMPONENTS IN COMPONENT RECEIVING CAVITY AND RELATED METHODSAbandonedMay 15, 14Nov 19, 15[H01L, H05K]
2015/0084,171 NO-LEAD SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAMEAbandonedSep 23, 13Mar 26, 15[H01L]
2015/0028,187 IMAGE SENSOR DEVICE WITH INFRARED FILTER ADHESIVELY SECURED TO IMAGE SENSOR INTEGRATED CIRCUIT AND RELATED METHODSAbandonedJul 23, 13Jan 29, 15[H01L]
2014/0061,447 RADIATION SENSORAbandonedSep 04, 13Mar 06, 14[G01S, G01R]
2014/0057,394 METHOD FOR MAKING A DOUBLE-SIDED FANOUT SEMICONDUCTOR PACKAGE WITH EMBEDDED SURFACE MOUNT DEVICES, AND PRODUCT MADEAbandonedAug 24, 12Feb 27, 14[H01L]
2013/0147,024 BALANCED LEADFRAME PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAMEAbandonedDec 13, 11Jun 13, 13[H01L]
2012/0161,319 BALL GRID ARRAY METHOD AND STRUCTUREAbandonedDec 23, 10Jun 28, 12[H01L]
2011/0156,033 METHOD AND SYSTEM FOR TRACING DIE AT UNIT LEVELAbandonedDec 31, 09Jun 30, 11[H01L, G06F]
2010/0327,421 IC PACKAGE DESIGN WITH STRESS RELIEF FEATUREAbandonedJun 30, 09Dec 30, 10[H01L]
2010/0187,651 INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAMEAbandonedOct 13, 09Jul 29, 10[H01L]
2010/0172,198 DATA STORAGE ELEMENT SENSING DEVICEAbandonedDec 29, 09Jul 08, 10[H01R, G11C]
2010/0167,471 REDUCING WARPAGE FOR FAN-OUT WAFER LEVEL PACKAGINGAbandonedJun 30, 09Jul 01, 10[H01L]
2010/0149,884 REDUCTION OF POWER CONSUMPTION IN A MEMORY DEVICE DURING SLEEP MODE OF OPERATIONAbandonedNov 11, 09Jun 17, 10[G11C]
2009/0265,739 METHOD AND SYSTEM FOR CHANNEL SELECTION IN A DIGITAL BROADCAST RECEPTION TERMINALAbandonedApr 18, 08Oct 22, 09[H04N, G06F]
2009/0167,363 REDUCTION OF SIGNAL SKEWAbandonedDec 31, 08Jul 02, 09[H03K]
2008/0282,024 Management of erase operations in storage devices based on flash memoriesAbandonedMay 09, 07Nov 13, 08[G06F]
7423466 Apparatus for enabling duty cycle locking at the rising/falling edge of the clockExpiredApr 28, 06Sep 09, 08[H03K]
7418031 Automatic baud rate determinationExpiredAug 06, 03Aug 26, 08[H04B]

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