STMICROELECTRONICS ASIA PACIFIC PTE LTD (SINGAPORE)

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 3359
 
  
 
H04L TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION 3282
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 2445
 
  
 
B01D SEPARATION 1133
 
  
 
B01F MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING 141
 
  
 
B01L CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE 157
 
  
 
C12M APPARATUS FOR ENZYMOLOGY OR MICROBIOLOGY 148
 
  
 
F04B POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS 161
 
  
 
F16K VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING172
 
  
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 1205

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9536112 Delaying or deterring counterfeiting and/or cloning of a componentJun 13, 12Jan 03, 17[H04L, G08B, G06F]
9338033 Recovering data from a primary one of simultaneous signals, such as orthogonal-frequency-division-multiplexed (OFDM) signals, that include a same frequencyJul 27, 12May 10, 16[H04L, H04K]
9229576 Apparatus and method for preventing false touches in touch screen systemsOct 09, 12Jan 05, 16[G06F]
9121526 Microfluidic device with bendable membrane having valve passageways to provide enhanced fluidic mobility control and related methodsSep 12, 12Sep 01, 15[F16K, B01L, F04B, B01F, B01D]
9083573 Simultaneous transmission of signals, such as orthogonal-frequency-division-multiplexed (OFDM) signals, that include a same frequencyJul 27, 12Jul 14, 15[H04L]
8906696 Deformable polymer testing deviceAug 23, 12Dec 09, 14[C12Q, C12M, G01N]
8705217 Electrostatic discharge protection circuitDec 24, 08Apr 22, 14[H02H]
8164179 Chip scale package structure with can attachmentDec 16, 08Apr 24, 12[H01L]
8054122 Analog switch with a low flatness operating characteristicDec 08, 09Nov 08, 11[H03L]
8013438 Semiconductor package with a stiffening member supporting a thermal heat spreaderJul 21, 09Sep 06, 11[H01L]

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Expired/Abandoned/Withdrawn Patents

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Top Inventors for This Owner

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