STATS CHIPPAC LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 63299
 
  
 
B81B MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES 132
 
  
 
H04L TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION 1284

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0141,238 Semiconductor Device and Method for Forming a Low Profile Embedded Wafer Level Ball Grid Array Molded Laser Package (EWLB-MLP)Jan 27, 16May 19, 16[H01L]
2016/0071,813 Semiconductor Device and Method of Self-Confinement of Conductive Bump Material During Reflow Without Solder MaskNov 09, 15Mar 10, 16[H01L]
2015/0364,430 Semiconductor Device and Method of Forming a Dampening Structure to Improve Board Level ReliabilityJun 16, 14Dec 17, 15[H01L]
2015/0325,553 Semiconductor Device and Method of Embedding TSV Semiconductor Die Within Substrate for Vertical Interconnect in POPJul 20, 15Nov 12, 15[H01L]
2015/0279,815 Semiconductor Device and Method of Forming Substrate Having Conductive ColumnsMar 28, 14Oct 01, 15[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9893017 Double-sided semiconductor package and dual-mold method of making sameApr 01, 16Feb 13, 18[H01L]
9837484 Semiconductor device and method of forming substrate including embedded component with symmetrical structureMay 27, 15Dec 05, 17[H01L]
9818734 Semiconductor device and method of forming build-up interconnect structures over a temporary substrateFeb 17, 15Nov 14, 17[H01L]
9786623 Semiconductor device and method of forming PoP semiconductor device with RDL over top packageMar 17, 15Oct 10, 17[H01L]
9768038 Semiconductor device and method of making embedded wafer level chip scale packagesDec 23, 13Sep 19, 17[H01L]
9768066 Semiconductor device and method of forming conductive vias by direct via reveal with organic passivationJun 26, 14Sep 19, 17[H01L]
9754897 Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuitsMay 26, 15Sep 05, 17[H04L, H01L]
9728415 Semiconductor device and method of wafer thinning involving edge trimming and CMPDec 19, 13Aug 08, 17[H01L]
9721922 Semiconductor device and method of forming fine pitch RDL over semiconductor die in fan-out packageDec 23, 13Aug 01, 17[H01L]
9701534 Semiconductor device and method of forming MEMS packageJan 27, 16Jul 11, 17[H01L, B81B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0357,274 Semiconductor Die and Method of Forming FO-WLCSP Vertical Interconnect Using TSV and TMVAbandonedAug 21, 15Dec 10, 15[H01L]
8900920 Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layerWithdrawnAug 11, 11Dec 02, 14[H01L, H05K]
2012/0326,324 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOFAbandonedJun 22, 11Dec 27, 12[H01L]
2012/0241,926 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEVELING STANDOFF AND METHOD OF MANUFACTURE THEREOFAbandonedMar 23, 11Sep 27, 12[H01L]
2012/0119,345 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DEVICE MOUNT AND METHOD OF MANUFACTURE THEREOFAbandonedNov 15, 10May 17, 12[H01L]
2011/0316,163 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MOLDED INTERCONNECTS AND METHOD OF MANUFACTURE THEREOFAbandonedJun 24, 10Dec 29, 11[H01L]
2011/0306,168 INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOFAbandonedAug 24, 11Dec 15, 11[H01L]
2011/0291,264 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POSTS AND METHOD OF MANUFACTURE THEREOFAbandonedJun 01, 10Dec 01, 11[H01L]
2011/0248,391 INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH LEAD OVERLAP AND METHOD OF MANUFACTURE THEREOFAbandonedMay 18, 10Oct 13, 11[H01L]
2011/0108,966 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONCAVE TRENCHES AND METHOD OF MANUFACTURE THEREOFAbandonedMar 23, 10May 12, 11[H01L]
2011/0062,599 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOFAbandonedSep 17, 09Mar 17, 11[H01L]
2010/0320,591 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONTACT PADS AND METHOD OF MANUFACTURE THEREOFAbandonedJun 19, 09Dec 23, 10[H01L]
2010/0133,534 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND FLIP CHIP AND METHOD OF MANUFACTURE THEREOFAbandonedDec 03, 08Jun 03, 10[H01L]
2010/0123,230 INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING BUMPED LEAD AND METHOD OF MANUFACTURE THEREOFAbandonedNov 20, 08May 20, 10[H01L]
2010/0078,831 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SINGULATION PROCESSAbandonedSep 26, 08Apr 01, 10[H01L]
2009/0243,068 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH NON-SYMMETRICAL SUPPORT STRUCTURESAbandonedMar 26, 08Oct 01, 09[H01L]
2009/0191,029 SYSTEM FOR HANDLING SEMICONDUCTOR DIESAbandonedJan 30, 08Jul 30, 09[H01L]
2009/0152,740 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLIP CHIPAbandonedDec 17, 07Jun 18, 09[H01L]
2009/0140,408 INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH STACKING VIA INTERCONNECTAbandonedNov 30, 07Jun 04, 09[H01L]
2009/0127,715 MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PROTRUSIONAbandonedNov 15, 07May 21, 09[H01L]

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