ST ASSEMBLY TEST SERVICES LTD.

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Patent Activity in the Last 10 Years

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H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8035204 Large die package structures and fabrication method thereforFeb 19, 10Oct 11, 11[H01L]
7575956 Fabrication method for semiconductor package heat spreadersNov 24, 03Aug 18, 09[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2005/0194,698 Integrated circuit package with keep-out zone overlapping undercut zoneAbandonedMar 03, 04Sep 08, 05[H01L]
2004/0222,520 INTEGRATED CIRCUIT PACKAGE WITH FLAT METAL BUMP AND MANUFACTURING METHOD THEREFORAbandonedSep 19, 02Nov 11, 04[H01L]
6770962 Disposable mold runner gate for substrate based electronic packagesExpiredJan 14, 02Aug 03, 04[H01L]
6604395 Semi-automated probe benderExpiredJul 23, 01Aug 12, 03[B21C, B21D]
6359336 Boat and assembly method for ball grid array packagesExpiredJun 04, 01Mar 19, 02[H01L]
2001/0002,320 Extended lead packageAbandonedNov 30, 00May 31, 01[H01L]

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