SPEEDFAM-IPEC CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 759
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
 
 
B65H HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES178

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2002/0023,719 Method and apparatus for removing a material layer from a substrateAug 30, 01Feb 28, 02[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7314402 Method and apparatus for controlling slurry distributionNov 15, 01Jan 01, 08[B24B]
6412656 Moistened wipe dispenserNov 14, 00Jul 02, 02[B65H]
6232640 Semiconductor device provided with a field-effect transistor and method of manufacturing the sameOct 06, 99May 15, 01[H01L]
5595529 Dual column abrading machineMar 28, 94Jan 21, 97[B24B]
5569062 Polishing pad conditioningJul 03, 95Oct 29, 96[B24B]
5498199 Wafer polishing method and apparatusJul 15, 94Mar 12, 96[B24B]
5486131 Device for conditioning polishing padsJan 04, 94Jan 23, 96[B24B]
5257478 Apparatus for interlayer planarization of semiconductor materialJan 31, 92Nov 02, 93[B24B]
5254830 System for removing material from semiconductor wafers using a contained plasmaMay 07, 91Oct 19, 93[B23K]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2005/0070,205 INTEGRATED PRESSURE CONTROL SYSTEM FOR WORKPIECE CARRIERAbandonedSep 30, 03Mar 31, 05[B24B]
6678911 Multiple vertical wafer cleanerExpiredDec 11, 00Jan 20, 04[B08B]
2003/0134,576 Method for polishing copper on a workpiece surfaceAbandonedJan 17, 02Jul 17, 03[B24B]
2003/0077,986 Front-reference carrier on orbital solid platenAbandonedNov 22, 02Apr 24, 03[B24B]
2003/0046,783 Polyvinyl acetate sponge and method for producing sameAbandonedSep 10, 01Mar 13, 03[B32B]
2003/0045,008 Method and apparatus for monitoring changes in the surface of a workpiece during processingAbandonedAug 31, 01Mar 06, 03[H01L, G01R, C23F]
2002/0191,197 Method and apparatus for optical multi-angle endpoint detection during chemical mechanical planarizationAbandonedJun 14, 01Dec 19, 02[G01B]
2002/0170,574 Differential Cleaning for semiconductor wafers with copper circuitryAbandonedMay 21, 01Nov 21, 02[B08B]
2002/0173,237 Apparatus and method for planarizing a workpiece and a workpiece handling wand for use in the methodAbandonedMay 16, 01Nov 21, 02[B24B]
2002/0166,569 Method and apparatus for semiconductor wafer cleaningAbandonedMay 10, 01Nov 14, 02[H01L, B08B]
2002/0155,795 Optical endpoint detection for buff module on CMP toolAbandonedApr 24, 01Oct 24, 02[B24B]
2002/0151,255 Chemical mechanical polishing method and apparatus for removing material from a surface of a workpiece that includes low-k materialAbandonedApr 17, 01Oct 17, 02[B24B]
2002/0151,987 Cascading PID control loops in CMP processAbandonedApr 13, 01Oct 17, 02[G05B]
2002/0145,728 Method and apparatus for a spectrally stable light source using white light LEDsAbandonedApr 06, 01Oct 10, 02[G01J]
2002/0124,730 Method and apparatus for separating liquid in a semiconductor cleaning deviceAbandonedMar 08, 01Sep 12, 02[B01D]
2002/0098,784 Abrasive free polishing in copper damascene applicationsAbandonedJan 19, 01Jul 25, 02[B24B]
2002/0099,465 Methods and apparatus for facilitating communication between devices via an industrial networkAbandonedJan 19, 01Jul 25, 02[G06F]
6415803 Method and apparatus for semiconductor wafer cleaning with reuse of chemicalsExpiredNov 05, 99Jul 09, 02[B08B]
2002/0081,948 Flexible bending member for a workpiece carrier apparatusAbandonedDec 26, 00Jun 27, 02[B24B]
2002/0077,049 Reinforced CMP carrier bladdersAbandonedDec 15, 00Jun 20, 02[B24B]

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