SMART PAC GMBH TECHNOLOGY SERVICES

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 489
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 1158

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8328068 Transfer device for receiving and transferring a solder ball arrangementApr 17, 08Dec 11, 12[B23K]
7926699 Method and device for transferring a solder deposit configurationSep 24, 09Apr 19, 11[B23K]
7762446 Method and device for transferring a solder deposit configurationSep 26, 05Jul 27, 10[B23K]
7049213 Method for producing a contact substrate and corresponding contact substrateMay 22, 02May 23, 06[H01L]
6713714 Method and device for thermally connecting the contact surfaces of two substratesJul 17, 01Mar 30, 04[B23K]
6642727 Chip carrier device and method for the production of a chip carrier device with an electrical testApr 02, 01Nov 04, 03[G01R]
6407457 Contact-bumpless chip contacting method and an electronic circuit produced by said methodNov 01, 00Jun 18, 02[H01L]

Expired/Abandoned/Withdrawn Patents

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Top Inventors for This Owner

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