SHINKO ELECTRIC INDUSTRIES CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 67967
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 33318
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 54151
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 30103
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 24135
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM19138
 
  
 
H01M PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY 19135
 
  
 
H01F MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 1866
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 1734
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1677

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0058,767 LOOP HEAT PIPEAug 16, 17Mar 01, 18[F28D]
2018/0047,661 WIRING BOARDJul 31, 17Feb 15, 18[H01L]
2017/0372,934 WAFER HOLDING APPARATUS AND BASEPLATE STRUCTUREJun 12, 17Dec 28, 17[H01L]
2017/0345,736 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGEMay 19, 17Nov 30, 17[H01L]
2017/0162,416 ELECTROSTATIC CHUCK AND SEMICONDUCTOR MANUFACTURING APPARATUSNov 10, 16Jun 08, 17[H01J, H01L]
2017/0162,520 LEAD FRAME, ELECTRONIC COMPONENT DEVICE, AND METHODS OF MANUFACTURING THEMNov 30, 16Jun 08, 17[H01L]
2017/0150,927 ADHESIVE PLASTER MODULEOct 31, 16Jun 01, 17[H01M, A61B]
2017/0098,600 WIRING BOARDAug 23, 16Apr 06, 17[H01L]
2017/0067,702 HEAT TRANSFER DEVICE AND METHOD OF MAKING HEAT TRANSFER DEVICEAug 31, 16Mar 09, 17[B23P, F28F]
2017/0025,386 SEMICONDUCTOR DEVICEJun 23, 16Jan 26, 17[H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9920232 Method of manufacturing metal composite material, metal composite material, method of manufacturing heat dissipating component, and heat dissipating componentJul 06, 15Mar 20, 18[C09K, C01B, F28D, B22F, F28F, C22C]
9922902 Semiconductor device and semiconductor packageMay 19, 17Mar 20, 18[H01L]
9922960 Packaging structure of substrates connected by metal terminalsJun 29, 16Mar 20, 18[H01L]
9918378 Wiring substrateOct 16, 17Mar 13, 18[H01L, H05K]
9911695 Wiring board including multiple wiring layers that are different in surface roughnessAug 23, 16Mar 06, 18[H01L]
9905504 Carrier base material-added wiring substrateSep 25, 17Feb 27, 18[H01L, H05K]
9899304 Wiring substrate and semiconductor deviceDec 16, 16Feb 20, 18[H01L]
9899310 Wiring substrate and method of manufacturing the sameOct 14, 16Feb 20, 18[H01L, H05K]
9893002 Terminal structure and wiring substrateDec 08, 16Feb 13, 18[H01L]
9887117 Electrostatic chuck and semiconductor-liquid crystal manufacturing apparatusMay 08, 15Feb 06, 18[H01L, H02N, G02F]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0143,139 ELECTRONIC COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAMEAbandonedNov 11, 15May 19, 16[H05K]
2015/0262,957 SEMICONDUCTOR PACKAGEAbandonedMar 04, 15Sep 17, 15[H01L]
9099478 Semiconductor package and method for manufacturing the semiconductor packageWithdrawnSep 10, 12Aug 04, 15[H01L, H05K]
2015/0206,833 WIRING SUBSTRATE HAVING COLUMNAR PROTRUDING PARTAbandonedMar 31, 15Jul 23, 15[H01L, H05K]
2015/0192,750 METHOD FOR MANUFACTURING CAMERA MODULEAbandonedNov 13, 14Jul 09, 15[G02B]
8760883 Wiring substrate and manufacturing method thereofWithdrawnJan 06, 12Jun 24, 14[H05K]
2014/0151,891 SEMICONDUCTOR PACKAGEAbandonedNov 22, 13Jun 05, 14[H01L]
8708713 Connecting terminal structure, manufacturing method of the same and socketWithdrawnOct 31, 11Apr 29, 14[H01R]
2014/0097,009 WIRING SUBSTRATEAbandonedSep 26, 13Apr 10, 14[H05K]
2014/0034,282 HEAT RADIATION COMPONENT AND METHOD FOR MANUFACTURING HEAT RADIATION COMPONENTAbandonedJul 26, 13Feb 06, 14[F28F]
2014/0030,504 ELECTROLESS PLATED FILM INCLUDING PHOSPHORUS, BORON AND CARBON NANOTUBEAbandonedJul 08, 13Jan 30, 14[C09D]
2013/0314,886 WIRING BOARD AND MOUNTING STRUCTUREAbandonedMay 13, 13Nov 28, 13[H05K]
2013/0153,271 WIRING BOARD AND METHOD OF MANUFACTURING THE SAMEAbandonedFeb 12, 13Jun 20, 13[H05K]
2013/0148,253 SUBSTRATE TEMPERATURE ADJUSTING-FIXING DEVICE AND MANUFACTURING METHOD THEREOFAbandonedNov 07, 12Jun 13, 13[H05K]
2013/0143,062 METHOD AND SUPPORT MEMBER FOR MANUFACTURING WIRING SUBSTRATE, AND STRUCTURE MEMBER FOR WIRING SUBSTRATEAbandonedDec 03, 12Jun 06, 13[B32B]
2013/0048,359 SUBSTRATE WITH SPRING TERMINAL AND METHOD OF MANUFACTURING THE SAMEAbandonedAug 14, 12Feb 28, 13[H05K]
2013/0048,350 BASE MEMBERAbandonedAug 17, 12Feb 28, 13[H05K]
2013/0000,955 WIRING BOARD AND MANUFACTURING METHOD OF THE SAMEAbandonedSep 12, 12Jan 03, 13[H05K]
2013/0001,767 PACKAGE AND METHOD FOR MANUFACTURING PACKAGEAbandonedJun 27, 12Jan 03, 13[H01L]
2012/0327,574 ELECTRONIC COMPONENTAbandonedJun 20, 12Dec 27, 12[H05K]

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