SHINKAWA LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 37325
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 2865
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 6150
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM4153
 
  
 
H05B ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR 2109
 
  
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 157
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1124
 
  
 
B29K INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS 130
 
  
 
B29L INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES 125
 
  
 
C09D COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR 191

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0148,759 BONDING APPARATUS AND BONDING METHODNov 03, 16May 25, 17[H01L]
2016/0365,330 METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND WIRE-BONDING APPARATUSAug 18, 16Dec 15, 16[H01L]
2016/0365,331 WIRE TENSIONERAug 24, 16Dec 15, 16[H01L, B23K]
2016/0358,883 BUMP FORMING METHOD, BUMP FORMING APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURING METHODAug 19, 16Dec 08, 16[H01L, B23K]
2016/0351,536 BONDING APPARATUS AND BONDING TOOL CLEANING METHODAug 10, 16Dec 01, 16[H01L, B08B, B23K]
2016/0163,673 WIRE BONDING APPARATUS AND BONDING METHODFeb 17, 16Jun 09, 16[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9922952 Method for producing semiconductor device, and wire-bonding apparatusAug 18, 16Mar 20, 18[H01L, B23K]
9899348 Wire bonding apparatus and method of manufacturing semiconductor deviceAug 12, 16Feb 20, 18[H01L, B23K]
9887174 Semiconductor device manufacturing method, semiconductor device, and wire bonding apparatusAug 18, 16Feb 06, 18[H01L]
9865563 Wire tensionerAug 24, 16Jan 09, 18[H01L, B23K]
9793236 Wire-bonding apparatus and method of manufacturing semiconductor deviceMay 15, 15Oct 17, 17[H01L, B23K]
9679866 Bonding stage and method of manufacturing the sameJan 07, 16Jun 13, 17[H01L, H05B]
9603262 Electronic component mounting apparatus and methodSep 30, 15Mar 21, 17[H01L, H05K]
9576927 Bonding tool cooling apparatus and method for cooling bonding toolJun 05, 15Feb 21, 17[F16K, F16L, H01L, B29C, B29K, B29L, B32B]
9536856 Flip chip bonder and flip chip bonding methodSep 08, 15Jan 03, 17[H01L, B23K]
9457421 Wire-bonding apparatus and method of wire bondingMay 15, 15Oct 04, 16[H01L, B23K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2014/0332,583 WIRE BONDING APPARATUSAbandonedJul 24, 14Nov 13, 14[H01L]
2014/0151,341 WIRE BONDING APPARATUSAbandonedFeb 03, 14Jun 05, 14[H01L, B23K]
2014/0034,712 BONDING APPARATUS AND BONDING TOOL CLEANING METHODAbandonedOct 04, 13Feb 06, 14[B23K]
2013/0153,644 ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHODAbandonedDec 03, 12Jun 20, 13[H01L]
2013/0001,280 METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE BONDING METHOD AND DIE BONDING APPARATUS USING THE METAL NANOINKAbandonedAug 21, 12Jan 03, 13[B23K]
7743964 Bonding apparatus and bonding methodExpiredFeb 26, 08Jun 29, 10[B23K]
7726546 Bonding apparatus and bonding methodExpiredFeb 26, 08Jun 01, 10[H01L, B23K]
2009/0020,872 WIRE BONDING METHOD AND SEMICONDUCTOR DEVICEAbandonedJul 15, 08Jan 22, 09[H01L]
4899121 Alternating current electromagnetExpiredMay 01, 89Feb 06, 90[H01F]
4526646 Inner lead bonderExpiredDec 05, 83Jul 02, 85[B23P, B65G, B32B, B44C]

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